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Article
Jing Liu
Technical Institute of Physics and Chemistry, Chinese Academy of Sciences
Corresponding Author
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Outstanding wide-bandgap semiconductor materials like gallium nitride (GaN) have been extensively utilized in power electronics, radiofrequency power amplifiers, and harsh environment adaptability. Due to its quantum confinement impact in enabling desired deep-ultraviolet emission, excitonic impact, and electronic transport features, two-dimensional (2D) GaN has been one of the most remarkable areas for the future growth of microelectronic devices. Here, for the first time, we report a large area, wide bandgap, and room-temperature 2D GaN synthesis and printing strategy via liquid metal gallium surface-confined nitridation reaction. The developed low-temperature synthesis and printing process is consistent with various electronic device manufacturing methods and thus opens a way for the cost-effective growth of the third-generation semiconductor. In particular, the fully printed field-effect transistors relying on the GaN show p-type switching with an on/off ratio greater than 105, maximum field-effect hole mobility of 53 cm2 V−1 s−1, and a small sub-threshold swing at room temperature. The current study establishes a room temperature way to produce the GaN, which can be further verified, generalized, and realized for various upcoming electronic and photoelectronic applications.
Keywords
2D GaN semiconductor, liquid metal gallium surface-confined nitridation reaction, microelectronic devices
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There is NO Competing Interest.
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- GaNSI.docx
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This preprint is under consideration at a Nature Portfolio Journal. A preprint is a preliminary version of a manuscript that has not completed peer review at a journal. Research Square does not conduct peer review prior to posting preprints. The posting of a preprint on this server should not be interpreted as an endorsement of its validity or suitability for dissemination as established information or for guiding clinical practice.
Nature journals have partnered with Research Square to offer In Review, a journal-integrated preprint deposition service.
Article
Jing Liu
Technical Institute of Physics and Chemistry, Chinese Academy of Sciences
Corresponding Author
Badges
Prescreen
This manuscript passed our Prescreen assessment
Complete author information
Appropriate declaration statements
Potential risks to human health
Prescreen
Peer Review Timeline
CURRENT STATUS: Under Review
Version 1
Posted 18 Nov, 2021
Metrics
Comments: 0
PDF Downloads: ...
HTML Views: ...
License:
This work is licensed under a CC BY 4.0 License. Read Full License
Outstanding wide-bandgap semiconductor materials like gallium nitride (GaN) have been extensively utilized in power electronics, radiofrequency power amplifiers, and harsh environment adaptability. Due to its quantum confinement impact in enabling desired deep-ultraviolet emission, excitonic impact, and electronic transport features, two-dimensional (2D) GaN has been one of the most remarkable areas for the future growth of microelectronic devices. Here, for the first time, we report a large area, wide bandgap, and room-temperature 2D GaN synthesis and printing strategy via liquid metal gallium surface-confined nitridation reaction. The developed low-temperature synthesis and printing process is consistent with various electronic device manufacturing methods and thus opens a way for the cost-effective growth of the third-generation semiconductor. In particular, the fully printed field-effect transistors relying on the GaN show p-type switching with an on/off ratio greater than 105, maximum field-effect hole mobility of 53 cm2 V−1 s−1, and a small sub-threshold swing at room temperature. The current study establishes a room temperature way to produce the GaN, which can be further verified, generalized, and realized for various upcoming electronic and photoelectronic applications.
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
There is NO Competing Interest.
This is a list of supplementary files associated with this preprint. Click to download.
- GaNSI.docx
Supplementary information
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