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Original Article
A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Ren-Ke Kang
Dalian University of Technology
Corresponding Author
License:
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Double-sided lapping is an ultra-precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress-related, including the processing stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven removal of double-sided material. The finite element simulation results were in good agreement with the experimental results.
Keywords
machining deformation, double-sided lapping, residual stress, finite element simulation
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Due to technical limitations, table 3 is only available as a download in the Supplemental Files section.
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CURRENT STATUS: Under Review
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Posted 15 Jan, 2021
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Reviewer #1 agreed
On 12 Feb, 2021
Reviewers invited
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This preprint is under consideration at Chinese Journal of Mechanical Engineering. A preprint is a preliminary version of a manuscript that has not completed peer review at a journal. Research Square does not conduct peer review prior to posting preprints. The posting of a preprint on this server should not be interpreted as an endorsement of its validity or suitability for dissemination as established information or for guiding clinical practice.
Learn more about In Review
Original Article
A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Ren-Ke Kang
Dalian University of Technology
Corresponding Author
Badges
Prescreen
This manuscript passed our Prescreen assessment
Complete author information
Appropriate declaration statements
Potential risks to human health
Prescreen
Peer Review Timeline
CURRENT STATUS: Under Review
Version 1
Posted 15 Jan, 2021
No community comments so far
Reviewer #1 agreed
On 12 Feb, 2021
Reviewers invited
Invitations sent on 07 Feb, 2021
Editor assigned
On 04 Jan, 2021
Submission checks complete
On 04 Jan, 2021
Editor invited
On 04 Jan, 2021
First submitted
On 03 Jan, 2021
Metrics
Comments: 0
PDF Downloads: ...
HTML Views: ...
Subject Areas
Mechanical Engineering
License:
This work is licensed under a CC BY 4.0 License. Read Full License
Double-sided lapping is an ultra-precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress-related, including the processing stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven removal of double-sided material. The finite element simulation results were in good agreement with the experimental results.
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Due to technical limitations, table 3 is only available as a download in the Supplemental Files section.