A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Double-sided lapping is an ultra-precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress-related, including the processing stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven removal of double-sided material. The finite element simulation results were in good agreement with the experimental results.
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Due to technical limitations, table 3 is only available as a download in the Supplemental Files section.
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Posted 15 Jan, 2021
On 12 Feb, 2021
Invitations sent on 07 Feb, 2021
On 04 Jan, 2021
On 04 Jan, 2021
On 04 Jan, 2021
On 03 Jan, 2021
A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Posted 15 Jan, 2021
On 12 Feb, 2021
Invitations sent on 07 Feb, 2021
On 04 Jan, 2021
On 04 Jan, 2021
On 04 Jan, 2021
On 03 Jan, 2021
Double-sided lapping is an ultra-precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress-related, including the processing stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven removal of double-sided material. The finite element simulation results were in good agreement with the experimental results.
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Due to technical limitations, table 3 is only available as a download in the Supplemental Files section.