DOI: https://doi.org/10.21203/rs.3.rs-181143/v1
This research of SiC ceramics milling with diamond tool is paid attention to the milling mechanism and the cracks formation to found the brittle–ductile transition. The ductile material removal process of ceramics milling was discussed based on milling geometric models. Based on the material characteristics and fracture mechanics theory of SiC ceramics, the chip formation process and the brittle–ductile transition of ceramics milling were analyzed. The milling experiments of SiC ceramics were carried out, and the effect of cutting parameters on material removal mode was investigated. Based on milling forces, surface topography and chip morphology, the removal mechanism of ceramics milling was analyzed. Diamond tool wear on the material removal and milling forces during milling was investigated. Different methods were compared to identify the critical milling parameters of brittle–ductile transition, which can be used to recommend the milling parameters for crack control and high quality cutting.