3.3. Passive oxidation of Si3N4 powders
Passive oxidation experiments were performed at different temperatures from 1000 to 1200°C to evaluate the oxidation kinetics. The first oxidation experiment was performed at 1000°C with a heating control of 7°C per minute. Figure 4 shows the comparative of mass gain rate between α-Si3N4 and (α + β)-Si3N4 with a similar behavior under 1000°C. It can be observed that the passive oxidation reaction starts at about 690°C even though the literature indicates that the temperature at which passive oxidation begins is at about 1000°C in an atmosphere of dry air [8]. Moreover, some authors mention that the temperature can vary from 600 to 950°C when the oxygen concentration is increased in the oxidizing atmosphere [9, 14, 15]. The present results indicate that the passive oxidation below 1000°C is negligible. Thus, it was decided to increase the heating rate to 30°C/min up to 1200°C.
According to Hou et al. [16], the passive oxidation occurs from the surface of the particle towards the nucleus, first transforming the superficial layers into SiO2 and with an intact nucleus of silicon nitride. Yang et al. [9], also mentioned that a time of 30 minutes at 1200°C is enough for the particle to be completely oxidized. The superficial passive oxidation of silicon nitride can be observed as translucent zones on the surface of the particles and can also be identified by the slight formation of necks between particles due to oxidation. The kinetic oxidation analyses of powders of α-Si3N4 and (α + β)-Si3N4 were carried out at 1200°C for 5 hours. Figure 5 shows the morphological comparison between α-Si3N4 and (α + β)-Si3N4 oxidized powders. The morphological analysis by SEM reveals that α-Si3N4 and (α + β)-Si3N4 do not present relevant changes in terms of morphology, but they do in terms of particle size distribution because of sintering of particles due to passive oxidation. On the other hand, the α-Si3N4 promotes nucleation and slow fine-grain growth in the crystallized proportion of SiO2. β-Si3N4 phase tends to promote coarse grain growth and the formation of defects in the interface with SiO2 [17]. In Fig. 5, the necks formation between particles is evident and can be considered as a sintering process. The formation of necks between particles can improve densification as occurs with Al2O3, Y2O3 and MgO which are used to promote the formation of a glassy phase used in some sintering processes [8, 18].
Figure 6 shows the crystallographic comparison between α-Si3N4 and (α + β)-Si3N4 before and after 5-hour oxidation. Regarding the structural analysis (Fig. 6a and b), no changes were identified despite knowing that the surface is composed of amorphous SiO2. The formation of SiO2 promotes sintering and densification of particles. There is evidence of the crystallization of SiO2 which favors the formation of microcracks at the interface [17]; although another work mentions that crystallization occurs at 870°C and SiO2 transforms from α-quartz to α-tridymite [9]. In this work, evidence of crystallization greater than 5% by weight was not found and, therefore, it was not identified by the X-ray diffraction technique.
On the other hand, the kinetic data reported by other authors are limited to obtaining the kinetic oxidation constant kp and the activation energy E. Moreover, no evidence was found in the literature about kinetic oxidation studies of β-phase silicon nitride on its influence in passive oxidation. Passive oxidation on silicon nitride has been mainly focused on obtaining a surface layer that facilitates the fluidity of Si3N4 slurries or promoting the formation of other phases such as Si2N2O [8, 19]. Therefore, there are mostly comparative studies between (α) and (β) silicon nitride that described the grain growth of the SiO2 phase [17]. Even though, it has been demonstrated [20] that the formation of Si2N2O does not occur unless a secondary treatment is given to Si3N4. In this work, evidence confirms that passive oxidation of silicon nitride improves the wettability with magnesium alloys.
Figure 7 shows the thermogravimetric results for α-Si3N4 and (α + β)-Si3N4. It can be observed that the influence of β-phase is null during heating process. The amount of β-phase has more impact in the oxidation process at a given temperature. Because the β-phase of Si3N4 is more stable than the α-phase; once it is formed, it can no longer be transformed into α-phase [13]. This implies that the amount of β-phase in the system reduces the oxidation kinetics. Due to the difficulty of quantifying the β-phase content, experiments cannot be carried out by changing the β-phase content in the system. Further experiments are required to better observe the β-phase dependence on the oxidation process as literature shows that silicon nitride is treated indifferently; regardless the amount of Si3N4 phase in the system [16].
As has been observed in Fig. 5, there are no important changes on the surface in terms of morphology. However, α-Si3N4 and (α + β)-Si3N4 achieved 4.86% and 2.87% mass gain, respectively. The findings has not been reported in a most recent review on the subject [8]. Being data that has been omitted over time, it is possible to obtain the parabolic oxidation rate constant and the surface reaction depth [21, 22].
To perform the kinetic calculations, the specific surface areas for α-Si3N4 and (α + β)-Si3N4 were obtained as 12.629 and 8.598 m2/g, respectively. Surface area measurements were obtained using a QuantaChrome surface area analyzer. For the case of the parabolic oxidation rate constant, kp, the following equation was used [21]:
Where W2 is the mass gain per unit area squared, expressed in g2/m4, kp is the kinetic oxidation constant, expressed in kg2/m4s and t is time. The kp is obtained from the slope by plotting W2 versus time. On the other hand, for the calculation of the oxidation depth, Eq. (5) may be applied [22].
$$d=\left( {\frac{{\% W}}{{100S}}} \right)\left( {\frac{{M(r)}}{{M(p) - M(r)}}} \right)\left( {\frac{1}{\rho }} \right)$$
4
Where d is the depth in (nm) of the oxidized layer, %W is the mass gain rate, S is the surface area of the material in (nm2/g), ρ is the density of the material, M(r) is the molecular mass of Si3N4 and M(p) is the molecular mass of SiO2. For the thermogravimetric analyses, the initial sample mass for α-Si3N4 and (α + β)-Si3N4 powders were 22.64 and 23.31 mg, respectively.
Figure 8 shows the oxidation kinetic constants obtained by the slope of the plot W2 versus time from the α-Si3N4 and (α + β)-Si3N4 thermogravimetric results. The oxidation kinetic constant achieved for α-Si3N4 was 9.11x10− 16 kg2/m4s and a Pearson R of 0.9889. The same procedure was carried out for (α + β)-Si3N4 powders obtaining an oxidation kinetic constant of 6.35x10− 16 kg2/m4s. These results indicate a strong dependence of the kinetic oxidation constant with temperature when compared with the other values in the literature. For example, at temperatures in the range of 1823 to 1923 K, Hirai et al. [23] found a higher kinetic constant, when working with α-Si3N4 manufactured by CVD, whose values are between 5.83x10− 11 and 2.22x10− 10 kg2/m4s. Similar values are reported by Ogbuji and Fox [12, 24] who calculated the kinetic constants being in the range from 1.75x10− 12 to 2.44x10− 11 kg2/m4s at the same temperature range. Moreover, Butt et al. [25] reported kinetic constants between 5.86x10− 25 to 1.71x10− 22 kg2/m4s at 973 and 1173 K, respectively. For temperature ranges close to this work like the results obtained by Franz et al. [26] at 1273 and 1533 K, the kinetic constants are between 3.4x10− 18 and 1.6x10− 17 kg2/m4s. This corroborates the impact of temperature on the passive oxidation of silicon nitride.
The results of the oxidation depth, as well as the kinetic constants are shown in Table 1.
Table 1
Oxidation kinetics constant and oxidation depth for both α-Si3N4 and (α + β)-Si3N4 powders.
Powder | Kinetics constant (kg2/m4s) | Oxidation depth (nm) |
α -Si3N4 | 9.11x10− 16 | 4.25 |
(α + β)-Si3N4 | 6.35x10− 16 | 3.69 |
As observed in Fig. 8, the slope of the curves of (α + β)-Si3N4 is lower which is likely due to the content of β-phase in the Si3N4 powders, this observation has not been fully studied in the past. The present results, based on thermogravimetric analyses, are in contradiction to the work of Backhaus-Ricoult et al. [17] who mentioned that the β-phase content increases the oxidation kinetics. Since it is well known that the β-phase is more stable, monocrystalline, and defect-free structure, the present results suggest that presence of β-phase decreases the oxidation rate as compared to α-Si3N4 alone. Backhaus-Ricoult et al. [17], also mentioned that the content of β-phase promotes a high density of defects in the oxidized interface and the formation of Sionite-type silicon oxynitride Si2N2O, because the oxidation mechanism is due to the decomposition of Si3N4 and the formation of amorphous SiO2, a devitrification and crystallization of SiO2 begins in the form of cristobalite that increases with the nitrogen content trapped during the decomposition of Si3N4. The cristobalite is easily formed at temperatures around 1300°C. Authors such as Narushima et al. [10] mention that the presence of Si2N2O decreases the oxidation kinetics, since it is a phase formed between the Si3N4 and SiO2 layers; Si2N2O phase also limits the diffusion of oxygen through the interface. There is no evidence of the formation of defects between the crystallized SiO2 grains for α-Si3N4. Trapped nitrogen is the one that plays the most important role during cristobalite grain growth and in its particle size distribution. In general terms, the β-phase promotes grain growth to large grains, which promotes the formation of defects as porosities and the formation of silicon oxynitride. In case of the α-phase, it promotes the nucleation of new grains with slow growth and fine grain size, avoiding the formation of defects and the formation of additional phases [17].
The present kinetic results were compared with other systems that have already been studied. Table 2 shows a comparison of the oxidation kinetic constants for different Si3N4 systems studied. As aforementioned no oxidation kinetic studies have been made taking into account the type of phase present in silicon nitride.
Table 2
Comparison of the oxidation kinetics constant and activation energy in different Si3N4 systems studied.
Type of Si3N4 | Oxidation Method | Atmosphere | Temperature (K) | Time (ks) | Kinetics | Activation Energy (kJ·mol− 1) | Ref. |
CVD (α) | Furnace | Wet O2 | 1073–1473 | | Parabolic | 119.3 | [27] |
CVD (α) | Ellipsometry | Dry O2 | 1373–1673 | 3.6–21.6 | Parabolic | 464 | [28] |
CVD (α) | Ellipsometry | Dry O2 | 1273–1573 | 32.4 | Parabolic 9.07 x10− 17 m2·s− 1 | 330.2 | [29] |
CVD (amorphous) | Thermogravimetry | O2, 0.1 Mpa | 1823–1923 | 36 | Parabolic (< 1923 K) 1823 K: 1.5 x 10− 11 kg2·m− 4·s− 1 1903 K: 5.8 x 10− 11 kg2·m− 4·s− 1 Linear (1923 K) 1.6 x 10− 7 kg·m− 2·s− 1 | 460 | [23] |
CVD (α) | Thermogravimetry | O2, Air, 0.1 Mpa | 1823–1923 | 36 | Parabolic O2 1823 K: 5.8 x 10− 11 kg2·m− 4·s− 1 1923 K: 2.2 x 10− 10 kg2·m− 4·s− 1 Air 1823 K: 3.6 x 10− 12 kg2·m− 4·s− 1 | 390 | [23] |
Powder* | Thermogravimetric | N2-20%O2 | 973–1173 | | Parabolic (Sample M-11) 973 K: 5.86 x 10− 25 m2·s− 1 1073 K: 2.11 x 10− 23 m2·s− 1 1173 K: 1.71 x 10− 22 m2·s− 1 Parabolic (Sample SN-E10) 973 K: 8.29 x 10− 25 m2·s− 1 1073 K: 4.26 x 10− 24 m2·s− 1 1173 K: 3.67 x 10− 23 m2·s− 1 | 230–260 | [25] |
Powder* | Thermogravimetric | N2-20%O2 | 1273–1473 | | Parabolic (Sample M-11) 1273 K: 1.14 x 10− 21 m2·s− 1 1373 K: 1.50 x 10− 20 m2·s− 1 1473 K: 2.03 x 10− 19 m2·s− 1 Parabolic (Sample SN-E10) 1273 K: 4.16 x 10− 22 m2·s− 1 1373 K: 1.72 x 10− 20 m2·s− 1 1473 K: 4.29 x 10− 19 m2·s− 1 | 400–540 | [25] |
Powder* | Furnace | Dry O2 | 1273–1533 | | Parabolic 1273 K: 3.4 x 10− 18 m2·s− 1 1373 K: 6.7 x 10− 18 m2·s− 1 1473 K: 1.15 x 10− 17 m2·s− 1 1503 K: 1.4 x 10–17 m2·s− 1 1533 K: 1.6 x 10− 17 m2·s− 1 | | [26] |
Powder* | Furnace | Dry O2 | 1503–1533 | | Parabolic 1503 K: 1.8 x 10–19 m2·s− 1 1533 K: 3.2 x 10− 19 m2·s− 1 | | [26] |
Powder* | Furnace | Wet O2 | 1273 | | Parabolic 1273 K: 3.8 x 10− 19 m2·s− 1 | | [26] |
Hot-Pressed* | Thermogravimetric | Dry O2 | 1623–1760 | | Parabolic 1623 K: 3.84 x 10− 11 kg2·m− 4·s− 1 1633 K: 5.22 x 10− 11 kg2·m− 4·s− 1 1666 K: 1.01 x 10− 10 kg2·m− 4·s− 1 1700 K: 1.74 x 10− 10 kg2·m− 4·s− 1 1731 K: 3.28 x 10− 10 kg2·m− 4·s− 1 1734 K: 3.41 x 10− 10 kg2·m− 4·s− 1 1752 K: 6.43 x 10− 10 kg2·m− 4·s− 1 1760 K: 7.63 x 10− 10 kg2·m− 4·s− 1 | 450–980 | [30] |
CVD (α) | Thermogravimetric | Dry O2 | 1473–1823 | 36 | Parabolic 1473 K: 1.75 x 10− 12 kg2·m− 4·s− 1 1573 K: 3.05 x 10− 12 kg2·m− 4·s− 1 1673 K: 8.33 x 10− 12 kg2·m− 4·s− 1 1773 K: 1.69 x 10− 11 kg2·m− 4·s− 1 1823 K: 2.44 x 10− 11 kg2·m− 4·s− 1 | 186 ± 44 | [24] |
CVD (α) | Thermogravimetric | Dry O2 | 1473–1773 | 360 | | 363 | [12] |
Hot-Pressed* | Volumetric Method | Dry O2 | 1521–1731 | 25.2–86.4 | Parabolic 1521 K: 1.27 x 10− 10 kg2·m− 4·s− 1 1621 K: 2.32 x 10− 9 kg2·m− 4·s− 1 1644 K: 1.62 x 10− 9 kg2·m− 4·s− 1 1668 K: 1.07 x 10− 9 kg2·m− 4·s− 1 1713 K: 1.27 x 10− 9 kg2·m− 4·s− 1 | 440 | [31] |
Powder (α) | Thermogravimetric | Dry O2 | 1473 | 18 | 9.11 x 10− 16 kg2·m− 4·s− 1 | | This work |
Powder (α + β) | Thermogravimetric | Dry O2 | 1473 | 18 | 6.35 x 10− 16 kg2·m− 4·s− 1 | | This work |
* Unknown type of phase in the silicon nitride |
3.6. Fabrication of AZ91/Si3N4 composites by infiltration technique
Fabrication of AZ91E/Si3N4 composites by several techniques has been carried out but with very low reinforcement content. The low reinforcement content is related to the low wettability between magnesium and silicon nitride [3, 4, 7]. Therefore, magnesium matrix composite materials are limited to manufacturing processes such as stir casting, squeeze casting, ultrasonic vibration, twin roll casting, shear compaction processing, powder metallurgy, in-situ reaction synthesis, mechanical alloying and even spray forming. In addition, processes such as stir casting have some disadvantages like the possibility of obtaining an heterogeneous distribution of the reinforcement particles, segregation, unwanted inclusions, and even porosity [36]. However, magnesium alloys in manufacturing processes for MMC such as pressureless infiltration is little considered in most recent reviews [36–38]. Pressureless infiltration is one of the most complete manufacturing processes for MMC due to the ease in changing composition of the alloy and reinforcement, also, it is one of the most economical processes, in addition to not requiring machining due to its near-net shaping property. Pressureless infiltration process is made possible by the passive oxidation of silicon nitride, due to the formation of SiO2 on the surface of the particles. Is well known that the contact angle between SiO2 and Mg is around 56° [39], promoting wettability between the oxidized Si3N4 particles and the magnesium alloy AZ91E.
Figure 11 shows the micrographs and chemical mappings of AZ91E/Si3N4 compound manufactured by pressureless infiltration. The infiltration was carried out at 800°C for 15 min, obtaining a complete infiltration of the alloy in the porous Si3N4 preform made with the powders previously oxidized for 30 min at 1200°C. Complete infiltration by gravity (Fig. 11a-f) and by capillarity (Fig. 11g-l) were obtained due to the good wettability between the alloy and the SiO2 of the superficial layer of Si3N4 powders. The compounds were manufactured in a 50–50% volume ratio, but with the advantage that this process facilitates the variation in reinforcement content.
The passive oxidation treatment becomes novel for the system AZ91/Si3N4 when it comes to magnesium matrix composite materials due that it improves the wettability and enables the pressureless infiltration process. However, there is only evidence of being used in alloys rich in titanium such as Mg-Ti-C and Mg-Ti-B reinforced with B4C [36], or in the alloy AZ91E reinforced with AlN [40]. In the latter, the predominant limitation is temperature since it is only feasible to infiltrate at 900°C, which is a high temperature for magnesium alloys due to its volatility and flammability.
The magnesium metal matrix composites can reduce the weight in automotive and aerospace industry [41] in addition to reduce CO2 emissions; and in the case of electric vehicles, their autonomy is increased [42]. The reduction on costs and manufacturing step processes increase the possible implementation of this kind of materials in the automotive industry [41]. Moreover, magnesium alloys are also capable of reducing weight in military vehicles and increase the ballistic impact resistance, however, their mechanical properties are limited [43, 44]. With the help of passive oxidized silicon nitride as a reinforcement, the mechanical properties of magnesium alloys can be improved for the above applications by means AZ91E/Si3N4 composites by pressureless infiltration.