CA–MQL Grinding of Zirconia Engineering Ceramics Under Precompressive Stress

doi:10.21203/rs.3.rs-2237950/v1

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CA–MQL Grinding of Zirconia Engineering Ceramics Under Precompressive Stress

https://doi.org/10.21203/rs.3.rs-2237950/v1

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published 26 Apr, 2023

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Engineering ceramics are widely used in aerospace, 3C electronics, life sciences and other fields. However, the hard brittleness of engineering ceramics makes it difficult to process, prone to damage during processing, and difficult to balance processing efficiency and quality. In this paper, the grinding force, surface morphology, subsurface damage, residual stress and roughness values of zirconia ceramics are studied after undergoing cold air minimal quantity lubrication (CA–MQL) and traditional wet lubrication (WET) at multiple grinding depths under 0 MPa, 200 MPa and 400 MPa precompressive stresses. The results show that CA–MQL significantly improves the grinding surface quality when the grinding depths are 30 µm and 50 µm compared with WET. The optimized surface roughness of 400 MPa precompressive stress combined with CA–MQL grinding reaches 17.12%. Precompressive stress significantly reduces the surface residual compressive stress by up to 32.8%.

precompressive stress

zirconia

CA–MQL

grinding

Engineering ceramics have attracted much attention in recent years due to their excellent thermal, mechanical, electromagnetic, optical and biological properties [1–3]. However, the high hardness and brittleness properties make machining damage inevitable in the process of engineering ceramics, which is mainly manifested as grain crushing, surface cracking, residual stress, etc. Machining seriously affects the surface qualities of zirconia ceramic products, reduces the strength and reliability levels of products, greatly reduces the processing efficiency and increases the processing cost [4, 5]. The cooling and lubrication methods play vital roles in the grinding process for determining the surface quality, production cost, tool life and cutting efficiency levels of the parts. The common cooling and lubrication methods are traditional wet lubrication, low-temperature lubrication, cold air lubrication (CA) and minimal quantity lubrication (MQL). The most widely used lubrication method is WET cooling, but this method greatly increases processing costs, poses a threat to workers' health and causes great pollution to the environment [6–8]. Therefore, methods for reducing processing damage, improving reliability, reducing processing costs and being environmentally friendly have become urgent problems regarding the processing of zirconia ceramics.

Due to the importance of cooling lubrication in grinding engineering ceramics, many scholars have conducted research on this topic. Engineer et al. [9] found that in traditional grinding, the actual efficiency of the cooling lubricant through the grinding zone ranges from 4%~30%, and a large amount of cooling lubricant is wasted. E. Brinksmeier et al. [10] found that cooling lubricants become waste after use, resulting in 17% of the processing costs in the manufacturing industry resulting from the consumption of lubricants, of which 54% of the cost is accounted for by waste lubricant treatment costs. Barczak et al. [11] proved that MQL has a lower grinding force and better cooling effect, and it is more economical and environmentally friendly than cast grinding. Emami et al. [12] found that the grinding force and surface roughness levels of Al₂O₃ ceramics effectively decrease by applying MQL with the best cooling parameters. Sadeghi et al. [13] applied MQL in the grinding of the difficult-to-cut material Ti-6Al-4V; the researchers found that compared with WET technology, MQL technology has a better grinding effect in metal grinding with high hardness and poor thermal performance qualities. Zhang et al. [14] proved that for Ti-6Al-4V material, cold air minimal quantity lubrication (CA–MQL) has a better cooling effect than cold air (CA) and MQL separately by constructing a theoretical model and performing experimental verification; the results showed the lowest tangential and normal grinding forces. Lopes et al. [15–18] studied the surface roughness results of CA–MQL versus MQL in the cylindrical grinding of AISI 4340 steel with an alumina grinding wheel.

As an effective method for suppressing material damage during processing, precompressive stress processing refers to applying pressure on parts in advance before actual processing, thereby reducing processing damage levels and improving the surface quality levels of parts. Heard and Cline [19] applied an axial pressure on a cylindrical BeO ceramic and found that the fracture mechanism changed from brittle to plastic in the pressure range of 400 MPa to 700 MPa, while AlN ceramics showed a similar change at 550 MPa. Kaitkay and Lei [20] conducted cutting experiments on rocks under high hydrostatic pressures using a turning tool coated with polycrystalline diamond. The application of high hydrostatic pressure effectively inhibited the formation of microcracks at the front end of the tool cutting path, promoted the formation of chips, changed the material removal mechanism from brittle removal to brittle-plastic removal, and improved the machining quality of the workpiece. Yoshino et al. [21–24] performed single point cutting and scratching experiments on various materials, such as monocrystalline silicon, quartz, and glass, under high hydrostatic pressure. The experimental results showed that the processing damage levels of the three materials under 400 MPa high hydrostatic pressure were significantly lower than those under 0 MPa. Tan et al. [25] conducted scratch and grinding experiments on alumina ceramics and silicon carbide ceramics under unidirectional precompressive stress. The results showed that the existence of precompressive stress effectively inhibited the scratching and damaging of ceramic materials during grinding.

The applications of CA–MQL and precompressive stress when grinding zirconia ceramics are rarely reported. In this study, the CA–MQL technique was used to cool the grinding of zirconia ceramics under two-dimensional precompressive stress; the results were compared with the casting lubrication method involving the same lubricant. The effects of two different lubrication methods on the surface quality, grinding force and residual stress levels of zirconia ceramics were explored during two-dimensional precompressive stress grinding of engineering ceramics, and satisfactory results were obtained.

This experiment was conducted on a MGK7120 × 6 high-precision CNC grinding machine from the Hangzhou Machine Tool Factory. The surface accuracy of the workpiece processed by the grinding machine reached Ra 0.08. The grinding wheel used in the grinding experiment was a resin-based diamond grinding wheel (ZZSM14A1200 * 20 * 32 * 10 * 0D80B10C) produced by Zhengzhou Abrasive Grinding Research Institute. The CTL-30/2 cold air jet machine of Chongqing Chengtian Company, Ltd., and the gas supply of CA–MQL are shown in Fig. 1. Both wet lubrication and CA–MQL were performed with TYC-C vegetable oil-based cold air grinding fluid from Chongqing Chengtian Company. In the grinding experiment, the grinding force was collected by a Kislter Model 9257B dynamometer from the Kislter Company. The surface roughness of the workpiece after grinding was measured by a MahrS2 surface topography measuring instrument from Mahr Company, Germany. The grinding surface of the workpiece was observed by a KEYENCE VHX-2000 superdepth microscope system. The residual stress of the grinding surface was tested by an LXRD residual stress tester from the Canadian PROTO company. The ceramic used in the grinding experiment was hot isostatic pressed zirconia ceramic with a size of 10 mm × 10 mm × 10 mm. The grinding parameters used in the grinding experiment are shown in Table 1.

Table 1

Grinding experimental parameters
Grinding parameters	Grinding wheel speed (m/s)	Cold air pressure (MPa)	Cold air temperature \((\text{℃}\))	Lubricant flow rate (mm³/min)	Grinding depth (µm)
Numerical	31.2	0.4	-30	0.3; 5000	10; 30; 50

3.1 Grinding force

Figure 2 shows the change trends of the grinding forces of zirconia ceramics. The diagram shows that the grinding forces of zirconia ceramics increase with increasing grinding depth under the same precompressive stress and increase with increasing precompressive stress under the same grinding depth. A comparison of the grinding forces of zirconia ceramics under two lubrication modes shows that the grinding force of CA–MQL is smaller than that of WET when the grinding depth is 10 µm at 0 MPa. When the precompressive stresses increase to 200 MPa and 400 MPa, the grinding forces of CA–MQL products gradually approach those of WET products at this grinding depth. When the grinding depth increases to 30 µm, the grinding forces of CA–MQL products are greater than those of WET products. The gap in the grinding force increases with increasing precompressive stress. When the grinding depth increases to 50 µm, the grinding force after using CA–MQL begins to be significantly greater than the grinding force after using WET, and the grinding forces of the two lubrication methods exhibit large gaps. This phenomenon occurs due to the grinding depth in the process of increasing the grinding area. The required lubricating fluid amount is greater under this condition because the CA–MQL fluid flow is low; the lubricating fluid entering the grinding zone when the grinding depth is large is not sufficient for achieving the best lubrication and cooling effects, resulting in a decrease in the CA–MQL efficiency. After applying precompressive stress, the grinding force begins to increase under the same grinding parameters. This phenomenon occurs because the precompressive stress inhibits the grinding crack propagation of zirconia ceramics, making material removal more difficult; these findings result in the grinding force under precompressive stress being greater than the grinding force without precompressive stress. The changes in the grinding forces under the WET and CA–MQL lubrication modes show that at 0 MPa, when the grinding depth is 10 µm, the anti-wear effect of CA–MQL is more obvious than that of WET. When the grinding depth increases to 30 µm, the lubrication effect becomes weaker than that of WET. The lubrication effect of CA–MQL is better than that of WET during precision grinding.

3.2 Surface morphology

Figure 3 shows the surface morphologies of zirconia ceramics under CA–MQL and WET at 0 MPa. Figure 3a, 3b, 3c and 3d show the surface topographies of CA–MQL grinding without precompressive stress, and Fig. 3(e), (f), (g) and (h) show the surface topographies of WET grinding without precompressive stress. The materials of the CA–MQL grinding surfaces at 10-µm, 20 µm, 30 µm and 50 µm grinding depths undergo plastic removal, the plastic grooves are obvious, the surface grains are less broken, and the coatings are thinner than those of the materials of the WET grinding surfaces. This phenomenon occurs because CA–MQL plays a key role in reducing wear during the grinding process. High-pressure air flow discharges the debris, abrasive particles and broken grains in the grinding core area from the workpiece surface in a timely manner, which greatly reduces the coating degree of the workpiece surface. However, under the condition of WET, with the increasing grinding depth, it is not difficult to find that the grinding groove becomes increasingly unclear. When the grinding depths reach 30 µm and 50 µm, the groove is difficult to find and is replaced by a large amount of grain crushing and brittle deformation. This phenomenon occurs because in the grinding process, the liquid flow rate of WET is relatively slow and the viscosity coefficient of the lubricating fluid is large; although the lubricating fluid enters the core area of grinding, it cannot discharge the grinding debris, abrasive particles or crushed grains from the surface of the workpiece in time. With increasing grinding depth, the material removal volume increases, the corresponding grain crushing increases, and the material fails to discharge in time. Therefore, a serious surface coating is produced, which greatly reduces the surface quality.

Figure 4 shows the grinding cross section under WET conditions when the precompressive stress is 0 MPa. Figure 4a shows the grinding cross section at a grinding depth of 10 µm. The grinding parameters under the damaged layer are approximately 3 µm because the grinding depth is shallow, the grinding force is relatively low, the less material removal occurs, the affected surface is shallow, the damaged layer thickness is relatively small, and the surface quality impact is relatively light. Figure 4b shows the grinding section when the grinding depth is 20 µm. Under this grinding parameter, the thickness of the damaged layer reaches approximately 7 µm. Compared with the damaged layer shown in Fig. 4a, the damaged layer is deeper, but it is not particularly obvious from Fig. 3e and Fig. 3f. Figure 4c shows the grinding cross section when the grinding depth is 30 µm. At this time, the thickness of the damaged layer reaches 17–20 µm, the damaged layer is obviously thickened, and it is difficult to see the groove marks from the grinding surface. Figure 4d shows the grinding cross section when the grinding depth reaches 50 µm. At this time, the thickness of the damaged layer reaches 24 ~ 28 µm. With the increase in the grinding depth, when the grinding depths reach 30 µm and 50 µm, due to the material removal rate increasing greatly, it is difficult for WET technology to discharge the wear debris in time, resulting in many broken grains remaining on the grinding surface; additionally, the thickness of the broken layer is not uniform, which is caused by the nonuniformity when the grinding debris is discharged.

Figure 5 shows the grinding surfaces when the grinding depth is 10 µm under different precompressive stresses. When the grinding depth is low, with the increase in precompressive stress, the densities of plastic grooves on the grinding surface obviously gradually increase. Due to the existence of precompressive stress, the ductility domain of ceramic material processing increases, the toughness of the material increases to a certain extent, and the actual cutting depth of the material decreases. The development of internal cracks in ceramic materials during processing is inhibited to a certain extent, reducing the processing damage. A certain coating area remains on the grinding surface in Fig. 5a, while the coating area in Fig. 5c significantly decreases, which is replaced by more obvious material plastic flow and dense plastic grooves. From Fig. 5a to Fig. 5c, the grain damage levels on the surfaces of zirconia ceramics significantly decrease with increasing precompressive stress, and the grinding surface wear marks are clear. A combination of appropriate precompressive stresses and CA–MQL technology effectively improve the grinding surface quality.

Figure 6 shows the surface roughnesses of zirconia ceramics when the precompressive stresses are 0 MPa and 400 MPa under two different lubrication modes. Under the same grinding parameters, the surface roughness increases with increasing grinding depth, which is caused by the increase in the grinding depth leading to an increase in the grinding temperature and the failure of the timely discharge of grinding debris. When the precompressive stress is 400 MPa, both lubrication methods significantly reduce the surface roughness. In particular, under this condition, the surface roughness of CA–MQL exhibits the largest decrease compared with that of WET lubrication without precompressive stress, and the maximum decrease is 17.1%. This phenomenon occurs because the precompressive stress reduces the surface grain breakage and surface roughness values of zirconia ceramics.

The surface morphology characteristics of zirconia ceramics with two lubrication methods under different precompressive stresses show that the grinding surfaces of CA–MQL products are always better than those of WET products under the same grinding parameters. Combined with the grinding force, it is seen that when the grinding depth increases to 30 µm, the grinding forces of zirconia ceramic products are higher than those of WET products when CA–MQL is used. However, Fig. 2 shows that although the grinding force increases, the surface morphology of CA–MQL products remain better than those of WET products. This phenomenon occurs because the high-pressure cold air jets the lubricating oil into the grinding zone in the grinding process and takes the debris out of the grinding zone in a timely manner to reduce the coating effect to achieve a better grinding effect, as shown in Fig. 8.

3.3 Surface residual stress

The residual stress of the zirconia ceramic surface to be machined is -352.7 MPa (compressive stress).

Figure 7a and Fig. 7b show the variation trends of the surface residual stresses of zirconia ceramics after using WET and CA–MQL, respectively. Figure 7c shows a comparison of grinding surface residual stresses of zirconia ceramics under two different lubrication conditions and different precompressive stresses. Figure 7a and Fig. 7b show that the relationship between the variation amplitude of the surface residual stress and the grinding depth of zirconia ceramics shows a trend of first decreasing and then increasing; with increasing precompressive stress, the variation amplitude of the residual stress decreases. This phenomenon occurs because when the grinding depth is 10 µm, the removal processes of zirconia ceramics are mainly plowing and plastic removal, which reduces the residual compressive stress. When the grinding depth increases to 30 µm, the removal mechanism of zirconia ceramics begins to change from plastic removal to brittle removal. Plastic removal and brittle removal mix, reaching an optimal value of residual compressive stress on the grinding depth so that the amplitude of residual compressive stress change reaches a minimum. When the grinding depth reaches 50 µm, although the brittle removal becomes more obvious, due to the higher grinding depth, the grinding force and temperature significantly increase, leading to more residual tensile stresses on the grinding surface; this phenomenon leads to an increase in the residual compressive stress. With increasing grinding depth from 10 µm to 30 µm and 50 µm, the amplitude of the residual compressive stress first decreases and then increases. Figure 8c shows that the change amplitude of the residual compressive stress decreases with increasing precompressive stress. As the precompressive stresses increase to 200 MPa and 400 MPa, the increase in the precompressive stress leads to a transformation of the plastic removal mechanism into a brittle removal mechanism. The phenomenon becomes more obvious; thus, the change in the residual compressive stress is low. From a comparison of lubrication methods, the same law as the previous grinding force is found. At low grinding depths, the surface residual stress generated by CA–MQL is better than that of WET under precompressive stresses of 0 MPa, 200 MPa and 400 MPa. This phenomenon occurs because high-pressure cold air helps nanoparticles enter the grinding zone to reduce the friction effect. With increasing grinding depth, the lubrication and cooling of CA–MQL are gradually lower than those of WET; thus, the residual compressive stress of the WET surface is lower than that of CA–MQL, which is the same as the grinding force. Therefore, the superiority of CA–MQL in precision grinding is found.

In this study, the grinding force, grinding surface, subsurface, roughness and surface residual stress values of WET and CA–MQL products with different grinding depths with and without precompressive stresses of 200 MPa and 400 MPa are analyzed and discussed. The results are as follows:

1. Under the lubrication conditions and parameters adopted in this study, with increasing precompressive stress and grinding depth, the grinding force increases, and the lubrication efficiency of CA–MQL begins to decrease.

2. The lubrication efficiency of CA–MQL is higher than that of WET when the grinding depth is small, but its grinding surface quality is always better than that of WET.

3. CA–MQL technology and precompressive stresses effectively reduce the grinding surface roughness by up to 17.1%.

4. In the direction of the grinding depth, the residual stresses on the grinding surfaces of the two materials first decrease and then increase. When the grinding depth is 10 µm, the surface residual stress is the largest; when the grinding depth is 30 µm, the surface residual stress is the smallest; and when the grinding depth is 30 µm, the surface residual stress increases to a value less than that of the surface residual stress when the grinding depth is 10 µm.

Author contribution Gaofeng Zhang contributed to the conception of the study; Wenbin Ma and Cezhi Du conducted various theoretical studies, designed experiments, analyzed the results, and wrote literature. Tiejun Song, Zhenyu Wang, Gang He, Hua Xie and Tao Jiang mainly participated in the experimental work.

Acknowledgements This work was supported by the National Natural Science Foundation of China (Grant Nos. 52275406),the Natural Science Foundation of Hunan Province (Grant. 2019JJ50591), and the Hunan Provincial Key Laboratory of Electromagnetic Equipment Design and Manufacturing (Grant. DC201902).

Data availability All data generated or analyzed during this study are included in this article.

Ethics approval This article does not contain any studies with human participants or animals performed by any of the authors.

Consent to participate Not applicable.

Consent for publication The authors consent to publish this article.

Conflict of interest The authors declare no competing interests.

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published 26 Apr, 2023

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Editorial decision: Minor Revisions Needed
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You are reading this latest preprint version

CA–MQL Grinding of Zirconia Engineering Ceramics Under Precompressive Stress

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Abstract

Figures

1 Introduction

2 Experiment

3 Results And Discussion

3.1 Grinding force

3.2 Surface morphology

3.3 Surface residual stress

4 Conclusion

Declarations

References

Status:

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