The grain structure, FESEM photo-image and elemental composition obtained using EDS of AA5083 and AA6082 are cited in Fig. 4 (a-d). The mean grain size of AA5083 and AA6082 was found to be ~ 35 and ~ 39 µm, respectively. The FESEM photo-image and elemental composition obtained using EDS of SiCp are cited in Fig. 4 (e, f). The Due to heat input and dynamic recrystallization (DRX) resulting from severe plastic deformation, three distinct zones are identified in the weld zone of the FSWed joints: the stir zone (SZ), the thermo-mechanical affected zone (TMAZ), and heat-affected zone (HAZ) [27, 28]. Compared to the HAZ and TMAZ, the SZ exhibited higher grain refinement [29].
Table 1
Experimental condition of various FSWed joints
FSWed joints | Tool rotating speed (rpm) | Transverse speed (mm/min) | Tool angle (degree) | Number of FSW passes | Volume fraction of SiCmp (%) |
One-pass FSWed unreinforced joint | 900 | 40 | 2 | 1 | 0 |
One -pass FSWed reinforced joint | 900 | 40 | 2 | 1 | 8 |
Two-passes FSWed reinforced joint | 900 | 40 | 2 | 2 | 8 |
Three-passes FSWed reinforced joint | 900 | 40 | 2 | 3 | 8 |
3.1 Microstructural characterization
To examine the influences of multi-pass FSW and SiC particles on the weld quality of AA6082 and AA5083 dissimilar joints, an investigation associated with the distribution of SiCp and grain structure of SZ was carried out. Figure 5 depicts the FESEM photo-image of the SZ of one-pass FSWed unreinforced joint and multi-pass (one, two and three) FSWed reinforced joints. The defect-free joining of AA6082 and AA5083 with the proper intermixing was observed in the one-pass FSWed unreinforced joint, as depicted in Fig. 5a. Figure 5 (b-d) depicts the FESEM photo-image of the SZ of one, two and three-passes FSWed reinforced joints and confirms the consequences of the increasing FSW passes on the dispersion pattern of particles.
The clustering of SiCp along with poor bonding with AMM was noticed in the SZ of the one-pass FSWed reinforced joint as delineated in Fig. 5b. This demonstrates that one FSW pass was not producing sufficient strain to prevent clustering of SiCp [30]. The clustering of SiCp was found absent as the FSW passes enhanced from one to two, but the dispersion pattern of SiCp was observed as non-uniform in the two-passes FSWed reinforced joint, as cited in Fig. 5c [31]. The augmented dispersion pattern of SiCp may be attributed to the repeated strain developed by the tool’s stirring action resulting in disjoining of clustering of SiCp as the FSW passes enhanced from one to two. Further improved dispersion of SiCp was found after implementing three passes of FSW. Therefore the uniform dispersion of SiCmp was observed after implementing three FSW passes, as cited in Fig. 5d. The absence of SiCp clustering revealed the excellent bonding between SiCp and surrounded AMM [32, 33]. The uniformity of SiCmp in the SZ of three-passes FSWed reinforced joints was confirmed by the EDS mapping analysis. It is evident from the Si elemental mapping (Fig. 5e) that the dispersion pattern of SiCmp is uniform after three passes of FSW. Referring to Fig. 6 (a-c), The EDS analysis of FSWed unreinforced joint and reinforced joints after one and three FSW passes also confirms the incorporation of SiCmp in FSWed reinforced joints. Considering the EDS analysis finding, the silicon percentage in the one-pass FSWed unreinforced joint was 0.56%, respectively. In contrast, the silicon percentage in the one-pass and three-passes FSWed reinforced joint was 6.98% and 7.66%, respectively. The carbon content in the one-pass and three-passes reinforced FSWed joint was 2.02% and 2.83%, respectively.
Figure 7 depicts the grain structure of the SZ of FSWed unreinforced joint and various reinforced joints. The stretched grain structure of AA6082 and AA5083 transformed into equiaxed and fined grains due to DRX [34]. The grain size of the SZ is mainly influenced by the temperature effect, DRX and RPs in the AMM. The dominating factors among these three phenomena decide the grain size. The temperature effect arises due to increased heat input at lower transverse speeds and higher rotating speeds, which induces grain growth and coarsening of grains [35]. DRX occurs at high temperature owing to severe plastic deformation resulting in the conversion of the low-angle boundaries to the high-angle boundaries and nucleates the new grains at developmental regions, which diminishes the grain size [36]. The RPs in the SZ serve as grain boundary barriers, inhibiting grain development via Zener-pinning effect [37]. Consequently, at constant rotating speed (900 rpm) and transverse speed (45 mm/min), the phenomena of DRX and the influence of SiCp dominated in diminishing the grain size. Whereas, Due to the absence of SiCp in FSWed unreinforced joint, only the DRX phenomenon dominated in diminishing the grain size. Thus, higher grain refinement was achieved in the three-passes FSW reinforced joints due to the DRX and the effect of uniformly distributed SiCp [38].
The coarse gain structure of AA 6082 and AA5083 exhibits the mean grain size of 39 and 35 µm, respectively. An abrupt reduction in the grain size was observed after implementing one-pass of FSW owing to DRX [39]. Therefore, a mean grain size of 19.4 µm (Fig. 7a) was found in the one-pass FSWed unreinforced joint, as delineated in Fig. 7a. The grain size of the one-pass FSWed reinforced joint was found to be smaller (12.6 µm) than one-pass FSWed unreinforced joint, as cited in Figs. 7a and b. This may be ascribed to the presence of SiCp in the SZ, as the same rotating speed and transverse speed were used for unreinforced and reinforced joints. As the FSW passes proceeded from one to three, it was observed that the grain size of SZ was further diminished. The further reduction in the grain size may be ascribed to the dispersion pattern of SiCp [40]. The more uniformly distributed RPs decreased the grain size by providing more obstacles to grain boundaries and restricting grain growth by the pinning effect [41]. When dislocations begin to accumulate during plastic deformation owing to RPs, the particles-induced nucleation-based DRX is feasible [42, 43]. The presence of more uniformly dispersed SiCp enhances the pinning effect, which results in higher grain refinement. Consequently, the grain size of the two-passes and three-passes FSWed reinforced joints was found to be 7.2 (Fig. 7c) and 3.4 µm (Fig. 7d), respectively. Thus, the grain structure of multi-pass FSWed reinforced joints evident that equiaxed and fine grains were developed owing to the domination of DRX and the pinning effect of uniformly dispersed SiCp [43].
3.2 Influence on tensile properties
In Fig. 8, the average tensile characteristics of the base materials and the various FSWed joints was presented. In the case of unreinforced joints, grain size is the key variable in influencing the mechanical characteristics of the FSWed joint. However, the size, quantity, dispersion pattern of RPs, and the bonding strength between the RPs and AMM also influence the mechanical characteristics of the FSWed reinforced joints [44]. It can be revealed from Fig. 8 that the tensile strength of the FSWed unreinforced and reinforced joints are lesser than that of the base materials. In contrast, the one-pass FSWed reinforced joint exhibits higher tensile strength than that of the unreinforced joint. This is ascribed to the existence of SiCp, which inhibits dislocation boundary movement and prevents grain development, resulting in reduced gain size [45]. The bonding between AMM and RPs, grain size, and dislocation density all significantly influenced the tensile strength of the FSWed reinforced joint [46]. The improved dispersion of SiCp was achieved by the increase in FSW passes. More uniform dispersion of RPs developed more barriers to grain development and further diminished grain size [47]. The tensile strength is inversely correlated with grain size, as stated by the Hall-Patch equation [48]. The grain size of FSWed reinforced joints was observed to be smaller than that of the base materials due to the pinning effect of SiCp and DRX [49]. Consequently, the three-passes FSWed reinforced joint exhibited a higher tensile strength of 247.17 MPa. Whereas the one-pass FSWed unreinforced joint exhibited the minimum tensile strength of 206.83 MPa. These observations are consistent with those of Jamalian et al. [50]. The %strain of one-pass FSWed unreinforced joint and reinforced joint was found to be higher than AA6082 but lower than AA5083. The %strain of the one-pass FSWed reinforced joint was observed lower than that of unreinforced joints and both the base alloys. But the %strain of two and three-passes FSWed reinforced joints was 12.2, and 13.1%, respectively, which is higher than the base materials.
Figure 9(a-d) depicts the fractography of the fractured tensile samples of various FSWed joints. The fracture occurred towards the AA6082 side at HAZ, where the hardness value was observed as minimal [51]. The dimple fracture, symptomatic of the ductile approach of failure, was noticed in all tensile samples. Under the tensile stress, the test samples’ edges formed a shear plane with a cup-cone shape [52]. In the FSWed reinforced joints, the ductile fracture with honeycomb dimples was identified (Fig. 9). The smaller dimple size was observed in the one-pass FSWed reinforced joint (Fig. 9b) compared to the one-pass FSWed unreinforced joint. From Fig. 9 (c, d), it can be noticed that the dimple size was further decreased as the FSW passes were enhanced from one to three. The diminished grain size was found in the three-passes FSWed reinforced joint via pinning effect of uniformly dispersed SiCp. The fractography of raptured surface (Fig. 9d) also revealed fine and equiaxed dimples developed by the micro voids’ coalescence [53, 54]. The ruptured zone was found at the HAZ towards AA6082, confirmed by hardness variation, which led to augmented %strain. Thus, it can be concluded that the embedded SiCmp ameliorated the tensile chrematistics of the FSWed joints. This may be correlated to the enhanced grain refinement by DRX and pinning effect of uniformly dispersed SiCp and excellent bonding between the SiCp and the AMM, resulting in higher resistance to fracture [55].
3.3 Influence on microhardness
The microhardness distribution in the weld zone of several FSWed joints of AA5083 and AA6082 was evaluated using a Vickers microhardness tester. The asymmetrical microhardness variation was noted in the weld zone of FSWed joints due to the irregular plastic flow in the retreating and advancing side [56]. The mean microhardness of base materials (AA6082 and AA5083) and at the center of the weld zone of FSWed joints is cited in Fig. 10a.
The one-pass FSWed unreinforced joint exhibited a microhardness of 93.2 HV, which is lower than that of AA5083 but higher than AA6082. According to the microhardness findings, one-pass FSWed unreinforced joint exhibits the lowest hardness compared to the multi-pass FSWed reinforced joints. The microhardness was enhanced by incorporating SiCp and implementing one, two and three passes of FSW. Therefore, the microhardness of one, two and three passes FSWed joints was observed as 105.8, 113.1 and 126.6.4 HV, respectively. The three-passes FSWed reinforced joint has the maximum microhardness of 126.6 HV among all the FSWed joints. The distribution of microhardness in the weld zone of the various FSWed joints is cited in Fig. 10b. The SZ indicates the higher microhardness owing to smaller grain size caused by the pinning effect of SiCp and DRX compared to the TMAZ and HAZ. In contrast, the microhardness in the HAZ was noticed lesser owing to coarsening of grains at high temperature and over-aging [57]. The microhardness of the FSWed reinforced joints was also augmented owing to the hard nature of SiCp. The three-passes FSWed reinforced joint revealed the highest microhardness due to better grain refinement than other FSWed joints.