3.1 Weight loss method
The corrosion rate (CR) and inhibition efficiency (%IE) from weight loss studies of copper in 0.5M H2SO4 in the presence and absence of MLA at room temperature for various immersion times (1-72 h) at different concentrations are illustrated in Table1. It is evident from these results that inhibition efficiency increases and the corrosion rate decreases on the addition of plant extract with concentrations at all immersion times up to 72 h. This is due to the adsorbed layer of the inhibitor acts as a barrier between the copper metal surface and the acid solution, leading to a decreasing corrosion rate. It is found that %IE is 77.39 in 0.5 M H2SO4 for the highest inhibitor concentration of 0.25g/L even at a longer immersion time of 72 h. The increase of %IE with increasing the inhibitor concentration indicates more inhibitor molecules are adsorbed on the copper surface in both acid media by blocking more corrosion active sites. The enhanced % IE may be explained due to the increase of adsorbed of inhibitor molecules on the metal surface with time [22]. Fig.1 shows the variation of inhibition efficiency of MLA with its concentration in 0.5M H2SO4 medium.
3.1.1 Temperature studies and thermodynamic parameters
To evaluate the nature of adsorption of MLA and activation parameters of the corrosion process of copper in 0.5M H2SO4 medium, weight loss measurements were carried out at various temperatures (303, 313, 323 and 333 K) in the absence and presence of MLA at different concentrations for 1 h immersion time and the data are shown in Table 2. It is observed that when the temperature is increased, the %IE decreased from 68.96 to 26.53, which is due to physisorption. The variation of %IE with temperature for various concentrations of the inhibitor in 0.5 M H2SO4 is shown in Fig. 2. As the temperature is increased, the inhibition efficiency decreased at all concentrations. This shows that MLA prevents the dissolution of metal ions in aggressive acids through physical adsorption. The activation energy (Ea) for Cu corrosion reaction at different inhibitor concentrations was found out from the slope of the Arrhenius plot
(log CR vs. 1/T) (Fig. 3),
where the slope is Ea/2.303 R, CR is the corrosion rate, R is the gas constant, and T is the temperature in absolute scale. These values are summarized in Table 3.
Ea values are higher for an inhibited solution than for the uninhibited one. The increasing value of activation energy with increasing concentration of extract shows that there is adsorption of leaves extracts on to the copper surface that blocks the active sites of copper specimens resulting in a decreased corrosion rate. Further, the corrosion rate decreases with an increase in temperature due to desorption. This is an indication of spontaneous adsorption of the inhibitor molecules on the copper surface and is attributed to physisorption [23-24]. The increase in the activation energy of the inhibited system is due to the adsorption of the inhibitor molecules on active sites.
3.1.1.1 Adsorption Isotherm
The nature of the interaction between the inhibitor and metal surface can be clearly explained by the adsorption isotherm. Attempts were made to fit the experimental data to assorted isotherms including Langmuir, Freundlich, Tempkin, Frumkin, El-awady, and Flory-Huggins. It has been found that the data fit well with the Langmuir adsorption isotherm (Fig. 4) with the correlation coefficient nearing almost unity.
The free energy of adsorption ∆Gads for various concentrations of inhibitor at different temperatures was calculated using the following equation:
∆Gads= -RT ln K(6),
where K = θ /Cinch (1 - θ), θ is surface coverage, Cinh is the concentration of inhibitor. It is described in the literature that a value of ∆Gadsupto -20 kJ mol-1or less negative implies that the adsorption is due to electrostatic interaction between charged molecules and a charged metal and the process indicates physical adsorption, while those more negative than -40KJmol-1 involves charge sharing or transfer from the inhibitor molecules to the metal surface to form a co-ordinate type of bond that indicates chemical adsorption [25]. Analysis of the data presented in Table 3 shows that the values of ∆Gads are less negative than -20 kJ mol-1suggesting physisorption. The negative value of ∆Hads indicates that the adsorption of inhibitor molecules on the metal surface is an exothermic process. It is observed that ∆Sads values in the presence of inhibitor are positive. This implies that the formation of the activated complex is the rate-determining step representing association rather than dissociation, indicating that a decrease in disorder on going on from reactants to the activated complex [26].
3.2 Electrochemical measurements
The corrosion behavior of copper in 0.5 M H2SO4 solution in the absence and presence of different concentrations of MLA was investigated using electrochemical measurements. The impedance data obtained from Nyquist plots for the above-mentioned systems are given in Table 4 and Fig. 5 (a). The impedance diagrams obtained for all the studied systems are not perfect semicircles. The imperfect semicircle (depressed semicircle) is attributed to the frequency dispersion as a result of the roughness and inhomogeneity of the electrode surface. This is an indication of the fact that the adsorption of the inhibitor molecules on the copper surface leads to the formation of a surface protective film, which reduces the corrosion active sites on the metal surface thus enhancing its corrosion resistance [27].
To get a more accurate fit for the experimental data, various circuits have been tried and the best accuracy is found with the simple Randles equivalent circuit. The Randles equivalent circuits used for impedance studies are given in Fig. 5 (b), where RS is a solution resistance, Cdl is the double layer capacitance and Rctis the charge transfer resistance. The electrochemical parameters of Rct, Cdl, and %IE in the presence and absence of MLA in 0.5 M H2SO4 are listed in Table 4. It is apparent from Table 4 that both the Cdl values and Rctvalues increase with increasing the inhibitor concentration. The increase in Rctin the presence of MLA is because the added inhibitor molecules displace the water molecules at the interface of the double layer leading to the transfer of charge from solution to the metal surface. The increase in Cdl values in the presence of the different concentrations of MLA compared to that of the blank solution is due to the decrease in local dielectric constant and/or an increase in the thickness of the electrical double layer. This suggests the adsorption of inhibitor molecules at the metal/solution interface. The adsorption can occur directly based on donor-acceptor interactions between the lone pair of electrons, π electrons in MLA, and the vacant d orbital of copper atoms [28].
The current potential relationship for copper corrosion in 0.5 M H2SO4 with different concentrations of MLA was investigated through the polarization measurements and the important parameters (Table 4) were obtained from the Tafel plots (Fig. 5 (b)). The Tafel slopes were calculated by the linear extrapolation of the cathodic and anodic branch of the polarization curves. Corrosion current (Icorr) was calculated from the slope of the polarization curve (ba and bc)and linear polarization resistance Rp was calculated using the Stern-Geary equation
Icorr = [ba bc / 2.303(ba + bc)] ×(1/Rp)(7)
The polarization data show the addition of the inhibitor alters both baand bc values suggesting that the inhibitor reduces both anodic dissolutions of the metal and retard hydrogen evolution reaction. This indicates the mixed nature of the inhibitor. The Icorr values decrease while increasing the concentration of inhibitors, which represents the higher surface coverage of the inhibitors [29-30].
3.3 Surface analysis
3.3.1 SEM analysis
The SEM images of the pure Cu sample, samples exposed for 72 h in 0.5 M H2SO4, and those exposed for 72 h in 0.5 M H2SO4 with 0.25 g/L of MLA are shown in Fig. 6. Analysis of Fig.6 reveals less damage in the Cu surface in the presence of inhibitor and the image shows the formation of protective films by the adsorbed bioactive species on the metal surface.
3.3.2 EDXS analysis
The EDXS images of the uninhibited and inhibited copper specimens are shown in Fig.7 (a and b) and the analytical data are collected in Table 5. Both the specimens show the presence of Cu, O, Si, Zn, and S. Comparison of the data shows a higher percentage of copper in the inhibited copper specimen. This indicates adsorption of the inhibitor molecules on to the copper surface, preventing dissolution of metal ions in the aggressive medium.
3.4 Analysis of the FT-IR spectra
Fig. 8(a) shows the FT-IR spectrum of the dried MLA extract. The broad peak at 3355.66 cm-1 is due to the O-H and/or N-H stretching vibrations. The peaks at 1608 cm-1 and 1711 cm-1 could be assigned to C=O stretching and N–H bending vibrations respectively. The peak at 1452 cm-1 indicates the presence of coupled C–O stretching and O–H in-plane bending vibrations. The IR spectrum of the dried MLA has been compared with the spectrum (Fig. 8 b) of the scrapped material from the copper surface after immersion in 0.5 M H2SO4 with MLA. A considerable positive or negative shift in the above-mentioned frequencies can be observed in the IR spectrum of the scrapped material. Hence, from the FT-IR and SEM-EDXS studies, it can be concluded that various organic constituents and groups with π electrons are effectively adsorbed on to the copper surface.