3.1. The shape of the inner wall of the channel under different alternating acid and alkali corrosion processes
The inner wall of the MCP channel will form a reactive surface after acid and alkali etching treatment, which has a greater impact on the subsequent degassing process and the emission performance of secondary electrons, the greater the roughness of the inner wall of the channel, the greater the reactive surface area. Alternating acid and alkali corrosion can effectively reduce the roughness of the inner wall of the channel, while the length of the alkali etching time will have a certain impact on the roughness. It is also considered that after reducing the alkali etching time, the core skin permeation layer may be difficult to remove, and the existence of this permeation layer will not only increase the surface roughness and cause electron memory effect[10],but also increase the adsorption of gas on the inner wall of the channel, which in turn brings ion noise. Therefore, a smooth channel surface is prepared by selecting a suitable etching process. In this paper, we first characterized the inner surface morphology of the channels of MCP treated with the above three corrosion processes using swept surface electron microscopy; secondly, we analyzed the microscopic morphology and roughness of the inner surface of the pores of MCP using atomic force microscopy.
According to Table 2 different acid-base alternating corrosion processes of MCP, after hydrogen reduction and cleaning, test its inner wall surface morphology. From Figure 2 (a) can be seen, Process 1 MCP, the channel wall there are more particles; Figure 2 (b) Process 2 MCP, the channel wall particle number significantly reduced; Figure 2 (c) Process 3 MCP, the channel wall no obvious particles. Figure 3 can be seen with the number of acid and alkali increase the number of particles in the channel wall significantly reduced. It can be speculated that increasing the corrosion intensity of MCP, the core-skin interface diffusion layer changes, and further in the hot hydrogen atmosphere, affecting the reduction of reducible metal oxides in the channel surface aggregation, resulting in changes in the conductive properties and secondary emission characteristics of the channel inner wall surface.
To further determine the particle composition, sample points 3 and 4, the characteristic points of the inner wall of the MCP channel from Process 1, were also selected and their EDS profiles were measured, as shown in Fig. 4. It is evident from the profiles that the highest content of lead and bismuth in the surface components of the inner wall of the channel may be due to the reduction process producing a new phase, i.e. the aggregation of lead atoms, resulting in an increase in the Z-axis height and surface roughness of the inner wall of the channel. The aggregation of lead atoms is in a diffusely connected state. In the diffusion state, the lead atoms combine into larger lead aggregates and are individually embedded in the bulk glass. After multiple new phases are created, the distance between the lead aggregates becomes smaller and a connected state is formed. At the same time the bismuth atoms produced by reduction also aggregate with the lead aggregates and form new aggregates. Therefore, suitable acid-base alternation during corrosion can improve the surface morphology and elemental distribution of the inner walls of the channels.
Further characterization of the inner wall morphology and roughness testing of the MCP for the three etching processes, Figure 5 (a) can be seen, Process 1 MCP, the channel inner wall surface appears larger island particles, and island particles peak height 31.1 nm; with the number of acid-base increase the number of island particles and peak height significantly reduced, Process 3 MCP the roughness of 1.9 nm. This acid etching stripping core after the glass skin glass surface appears island structure, these island particles in the fiber drawing have been formed at the interface, indicating that the core skin glass interface diffusion there is mutual reaction diffusion[18] .
3.2. Dark currents and background noise under different acid-base alternating processes
Firstly, the electrical properties of the MCP itself after three corrosion processes were compared and analyzed, as shown in Table 3, it can be seen that the (c) body resistance decreases with the increase of the alternating acid and alkali of the corrosion process. Then the test data of dark current under different acid-base corrosion processes were further tested, and the schematic diagram is shown in Fig. 6 below. Noise tests were carried out on the microchannel plates after different numbers of acid-base corrosion, and the background noise tested by the customer Jilin University was taken as the final evaluation. It can be seen that compared to the Process 1 MCP, the MCP treated with the increased acid-base alternating corrosion process shows a better noise profile in the component and customer tests, as shown in the Fig. 8. Analysis of the reasons for the reduction in noise is mainly because with the addition of alternating acid-base etching, there is greater correlation between the inner wall roughness and the state of the alkali metal on the surface, where the inner wall islands of particles are prone to tip discharge, resulting in a greater background noise; the increased roughness of the inner wall may result in more gas adsorption on its surface, which ionizes at high voltages and is accelerated in the opposite direction of the electric field to the input of the channel and has the opportunity to collide with the photoelectric. These additional electrons are then re-generated as secondary electrons by the channel electric field, resulting in ion feedback noise. Similarly for alkali metal ions with small atomic radii attached to the channel surface, they can also be affected by the operating voltage and migrate off the inner wall of the channel, resulting in similar ion feedback. Finally, Process 1 MCP, which has a higher dark current, and Process 3 MCP, which has a lower one.
Table 3
Electrical properties of different acid-base alternating corrosion processes.
Sample
|
Bulk Resistances
|
Gain
|
Number
|
Process 1 MCP
|
379
|
15320
|
6
|
Process 2 MCP
|
216
|
13620
|
7
|
Process 3 MCP
|
138
|
17213
|
6
|
3.3. Changes in background noise under different voltages and screen voltages
As the MCP voltage and screen voltage change, the background noise also changes accordingly. We selected the background at a screen voltage of 3800V and an MCP voltage of 1550V as the base background subtraction, and measured the trend of background noise changes at fixed screen voltage and different MCP voltage, as well as the trend of background noise changes at constant MCP voltage and different screen voltage, as shown in Figs. 9 and 10. It was found that the number of noise generated with the increase of MCP voltage is much higher than that generated with the increase of screen voltage, as shown in Figs. 11 and 12. Which may be due to the low surface potential barrier of MCP material under high voltage, and “hot-spots” caused by debris on the MCP surface are excluded, which is easy to escape more electrons[19].