This paper presents an automated high-speed die edge detection method that is meant to be implemented in non-destructive die-level defects inspection in the semiconductor industry. This paper specifically aims to achieve high accuracy (or yield) of greater than 99.95% with stable performance within a short computation time (i.e., less than 30 ms), provided the targeted unit-per-hour (UPH) is at 30,000. To demonstrate the applicability of the proposed method, the proposed method is validated using three production units (i.e., Production units A: 6000 units; Production unit B: 3500 units; Production unit C: 4000 units) and is benchmarked to two common edge detection methods that are widely implemented in the semiconductor industry nowadays (i.e., cross-correlation and normalized cross-correlation methods). The results obtained show that the proposed method is capable to perform die edge detection with promising accuracy and stable performance by achieving 100.0% yield in all three production units and outperformed the benchmarking methods. Also, the overall computation time (considering die edge detection and die rotation) of the proposed method is short, which is approximately 30 ms.