J Sun, W Cheng, et al. Fabrication of Superhydrophobic Micro Post Array on Aluminum Substrates Using Mask Electrochemical Machining. Chinese Journal of Mechanical Engineering, 2018, 31: 72.
J Sun, W Cheng, J L Song, et al. Fabrication of Microlens Array and Its Application: A Review. Chinese Journal of Mechanical Engineering, 2018, 31: 16.
 W L Shan, Y Yang, K T Hillie, et al. Role of oxide thickening in fatigue crack initiation in LIGA nickel MEMS thin films. Materials Science and Engineering: A, 2013, 561: 434-440.
L Xu, Y Liu. A Microresonant Gas Sensor by Micro-Electroforming. Journal of Micro and Nano-Manufacturing, 2016, 4: 014501.
M Zhao, L Du, C Du, et al. Liu, Quantitative study of mass transfer in megasonic microelectroforming based on mass transfer coefficient: Simulation and experimental validation. Electrochimica Acta, 2019, 297: 328-333.
 Z Zhao, L Du, Z Xu, L Shao. Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate. Ultrasonics Sonochemistry, 2016, 29: 1-10.
 Z Zhao, P Zhu, L Yang, et al. Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate. Journal of Adhesion Science and Technology, 2018, 33: 1-13.
 C Zhang, B Liu, B Yu, et al. J. Influence of surface pretreatment on phosphate conversion coating on AZ91 Mg alloy. Surface and Coatings Technology, 2019, 359: 414-425.
 L Shao, L Wang, L Du. Inflence of initial current density on bonding strength between Ni layer and Cu substrate in microelectroforming. Journal of Adhesion Science and Technology, 2016, 30: 2013-2023.
 Z Zhao, L Du, Y Tao, et al. Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application. Ultrasonics Sonochemistry, 2016, 33: 10-17.
 J Liu, D Zhang, B Sha, et al. Fabrication of a three-layer SU-8 mould with inverted T-shaped cavities based on a sacrificial photoresist layer technique. Biomedical Microdevices, 2014, 16: 655-660.
 S Arai, T Hasegawa, N Kaneko. Fabrication of three-dimensional Cu/Ni multilayered microstructure by wet process. Electrochimica Acta, 2004, 49: 945-950.
 X Huang, G Liu, X Ying, et al. Applications of thick Sacrificial-Layer of zinc in LIGA process. Microsystem Technologies, 2008, 14: 1257-1261.
 K H Lau, A Giridhar, H Sekar. Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates. Microsystem Technologies, 2013, 19: 1863-1871.
 D L Steven, T S Daniel. In-situ fabrication of sacrificial layers in electrodeposited NiFe microstructures. Journal of Micromechanics and Microengineering, 1999, 9: 97-104.
 L Du, M Zhao, A Wang, et al. Fabrication of novel MEMS inertial switch with six layers on a metal substrate. Microsystem Technologies, 2015, 21: 2025-2032.
[dataset]  Y B Wu, G F Ding, H Wang, et al. Efficient solution to selective wet etching of ultra-thick copper sacrificial layer with high selective etching ratio. IEEE, 2011.
 G Zhang. EFAB: A novel, high-aspect-ratio true three-dimensional microfabrication process for rapid, low-cost desktop micromachining of MEMS. University of Southern California, Los Angeles, 1999, pp. 132-135.
S Wen, X Ji, Y Zhou, et al. Corrosion behavior of the S136 mold steel fabricated by selective laser melting. Chinese Journal of Mechanical Engineering, 2018, 31: 108.
 M Li, A Seyeux, F Wiame, et al. Insights on the Al-Cu-Fe-Mn intermetallic particles induced pitting corrosion of Al-Cu-Li alloy. Corrosion Science, 2020, 176: 109040.
 I Moravcik, N S Peighambardoust, A Motallebzadeh, et al. Interstitial nitrogen enhances corrosion resistance of an equiatomic CoCrNi medium-entropy alloy in sulfuric acid solution. Materials Characterization, 2021, 172: 110869.
 R Viroulaud, J Swiatowska, A Seyeux,et al. Influence of surface pretreatments on the quality of trivalent chromium process coatings on aluminum alloy. Applied Surface Science, 2017, 423: 927-938.
 A Zarebidaki, H Mahmoudikohani, M R Aboutalebi. Microstructure and corrosion behavior of electrodeposited nano-crystalline nickel coating on AZ91 Mg alloy. Journal of Alloys and Compounds, 2014, 615: 825-830.
 L Wang, D Zhang, L Guo. Phase-segregated Pt-Ni chain-like nanohybrids with high electrocatalytic activity towards methanol oxidation reaction. Nanoscale, 2014, 6: 4635-4641.
 T Chen, H John, J Xu, et al. Influence of surface modifications on pitting corrosion behavior of nickel-base alloy 718. Part 1: Effect of machine hammer peening. Corrosion Science, 2013, 77: 230-245.
 M H Bina, F Dehghani, M Salimi. Effect of heat treatment on bonding interface in explosive welded copper/stainless steel. Materials and Design, 2013, 45: 504-509.
 H Yang, J Zou, Q Shi, et al. Analysis of the microstructural evolution and interface diffusion behavior of NiCoCrAlYTa coating in high temperature oxidation. Corrosion Science, 2019, 153: 162-169.
 T Massoud, V Maurice, L H Klein, et al. Intergranular effects on the local electronic properties of the passive film on nickel. Corrosion Science, 2013, 69: 245-251.
 E Sikora, D Macdonald. Nature of the passive film on nickel. Electrochimica Acta, 2003, 48: 69-77.
 U Angst, E Bernhard, C K Larsen, et al. Chloride induced reinforcement corrosion: Rate limiting step of early pitting corrosion. Electrochimica Acta, 2011, 56: 5877-5889.
 D Xiang, X D Cheng, C Q Yuan, et al. Structure of Micro-nano WC-10Co4Cr Coating and Cavitation Erosion Resistance in NaCl Solution. Chinese Journal of Mechanical Engineering, 2017, 30:1239-1247.
 J L Luo, M B Ives. Pit Propagation of Nickel and Nickel Molybdenum Alloys. Journal of The Electrochemical Society, 1997, 144: 3907-3913.
J Soltis. Passivity breakdown, pit initiation and propagation of pits in metallic materials – Review. Corrosion Science, 2015, 90: 5-22.