Since the demand of advanced packaging for semiconductor industry becomes higher for smaller and thinner applications such as mobile phone, wearable devices, etc., adapting high-aspect ratio of pin in packaging becomes more important. As the aspect ratio of pin becomes bigger, it is challenging to mount pins on the substrate under high speed. Novel mounting method for pin mounting is suggested but its mounting efficiency is possibly affected by mask dimensions. Two criteria are proposed to evaluate the mounting efficiency and calculated to validate the results from the simulation results in stochastic approach. Three design parameters are considered for the analysis and simulations are conducted. Simulations results show similar tendency compared to the calculation of criteria, mounting angle, and ratio. The highest mounting efficiency is observed when the hole diameter of a mask is increased. These results can be used to design a mask with various aspect-ratio of pins for packaging.