Phenolic resin (PR) is a widely utilized polymer material, favored for its easy availability of raw materials, convenient synthesis, affordability, and high bonding strength, which have led to its extensive application in industrial production[1, 2]. Compared to other polymers, PR exhibits superior high-temperature resistance, higher char yield, reduced smoke emissions, and lower toxicity, making it a popular choice in various high-temperature applications[3]. However, its protective capabilities under extreme conditions, such as in rocket and aircraft fuselage paint films, where temperatures and impacts are more severe, are often inadequate. Consequently, the modification of PR to further enhance its high-temperature performance and mechanical properties is of significant interest.
In the molecular structure of conventional PRs, the phenolic hydroxyl groups and methylene bridges are susceptible to oxidation. PRs can be used stably for extended periods at temperatures below 200 ℃. However, if the temperature exceeds 200 ℃, the resin undergoes oxidation, and between 340 ℃ to 360 ℃, it enters the thermal decomposition phase. At temperatures ranging from 600 ℃ to 900 ℃, the resin thermally decomposes, releasing substances such as CO, CO2, H2O, and phenol, while undergoing carbonization, which affects its thermal resistance and antioxidative properties. Consequently, many researchers have focused on the functional modification of PRs. In recent years, with the expansion of applications for PRs, extensive and systematic research has been conducted, yielding several new findings. Among these, due to the tendency of PRs to decompose at high temperatures, there has been considerable research on modifications to enhance their high-temperature resistance. The methods for modifying the high-temperature resistance of PRs primarily include the introduction of boron elements[4], silicon elements[5], the synergistic modification by introducing both silicon and boron elements[6], and the incorporation of nanomaterials[7]. Boron modification is a common method for enhancing the heat resistance of PRs[8–11]. By incorporating boron elements into PR via B-O-C bonds, the thermal decomposition temperature and char yield of the resin can be increased[4]. The presence of B-O-C bonds also reduces the content of easily oxidizable phenolic hydroxyl groups, thereby enhancing the heat resistance of the resin[12]. Studies by Wang et al.[13] on the thermal decomposition behavior of boron-modified PR at high temperatures have shown that during the high-temperature curing process, borophenol esters are produced. These esters react with phenolic hydroxyl groups to prevent the thermal decomposition of the cross-linked network, thus improving the material's thermal stability. Moreover, at 400 ℃, borophenol esters consume oxygen to form B2O3, which prevents the loss of carbon through CO2 volatilization, thereby increasing the char yield. Xing et al.[14] identified that the release of volatile organic compounds at 300 ℃, such as monophenols and biphenols formed through the cleavage of terminal C-C single bonds, is a primary reason for the reduction in char yield of PRs at high temperatures. These volatile organic compounds are primarily produced by the cleavage of covalent bonds. In boron-modified PRs, the borate ester bonds formed between boron hydroxyl and phenolic hydroxyl groups increase the molecular weight of small molecules, making them less volatile. The presence of borate ester bonds also alters the thermal decomposition process of PR, reducing the formation of monophenols and biphenols. Thus, the modification of PR with boric acid to enhance its heat resistance is widely utilized.
However, chemical modifications at the molecular level alone are insufficient to maximize the heat resistance of PR. Enhancing or altering the flame-retardant layer formed upon heating, can further improve heat resistance. Ceramization is one effective method to enhance the high-temperature resistance of polymers. Compared to other flame-retardant polymer materials, ceramizable composites exhibit higher thermal stability, non-toxicity, excellent thermal barrier properties, and the ability to retain their shape after the complete degradation of the polymer matrix at high temperatures[15]. Ceramizable materials display polymer characteristics at room temperature but exhibit ceramic properties when heated to a certain extent[16–19]. The mechanical and thermal insulation properties of the ceramic layer formed at high temperatures far exceed those of ordinary char layers, ensuring that the residues obtained after thermal degradation of the composites at high temperatures have a higher density[20–22]. In high temperatures, the ceramizable composites matrix undergoes pyrolysis while the fluxing agent melts. As the temperature increases, the ceramizable fillers gradually decompose, reacting with the char produced by the matrix and the low-melting-point fluxing agent to form a ceramic layer. Agrawal et al.[23] utilized mathematical analysis to calculate the impact of various factors such as the shape and size of filler particles on the effectiveness of the filler. The results demonstrated that the optimal performance of the fillers is achieved when the particle size is below 2 to 3 nm. Regarding the shape of the fillers, disc-shaped particles exhibited superior effectiveness compared to spherical and elliptical particles. Ceramic fillers, depending on their type, can be categorized into mineral fillers, metal oxides, metal hydroxides, and other types of fillers. Mica, a commonly used mineral filler with a layered structure, offers excellent high-temperature resistance, mechanical properties, and dielectric properties. At high temperatures, the original crystal structure of mica is disrupted, and it reacts with the products of matrix pyrolysis and other fillers to form a eutectic mixture, which then creates a rigid ceramic[24]. Glass powder, an amorphous hard particle primarily containing oxides like SiO2, Al2O3, CaO, Na2O, K2O, and P2O5, reduces the temperature at which ceramics form and creates a more continuous and integral ceramic structure[25, 26]. At temperatures between 300–700 ℃, glass powder gradually melts, filling the gaps between fillers and the pores left by gas expulsion, and connecting the ceramizing fillers to form a continuous ceramic[27].
Fiber-reinforced polymer composites possess several advantages such as low density, high strength, and superior thermal insulation properties. Thus, fiber-reinforced composites are extensively utilized in automobiles, aircraft, spacecraft, ships, civil infrastructure, and wind energy applications[28–32]. Glass fibers (GF), known for their high temperature resistance, corrosion resistance, and lightweight properties, serve as excellent matrix materials for composites, thereby finding applications in the aerospace sector where thermal stability, high temperature resistance, and superior mechanical properties are required. Wagner et al.[33], have conducted experimental and numerical evaluations of different aerospace-grade composites under high-speed impacts, characterizing materials including thermosetting (epoxy resin) and thermoplastic polymers (PEEK), as well as carbon (unidirectional and woven) and GFs. Results indicate that GF composites surpass traditional composites in weight-specific impact performance. Fibers commonly used for modifying PRs include GFs, carbon fibers, and natural hemp fibers[34]. GF, due to its low cost and chemical stability, is widely used as a reinforcement material for PR, enhancing both its mechanical properties and high-temperature resistance[35]. Choe et al.[36] reinforced PR foam with GFs, and the reinforced composites exhibited a maximum tensile strength of 148 kPa, a 28% improvement over pure PR foam. Additionally, the thermal conductivity of the composites was also enhanced. Zhou et al.[37] enhanced phenolic foam with GF mats, which resulted in improved mechanical properties and storage modulus of the reinforced phenolic foam. The enhancements included a 112% increase in tensile strength, a 36% increase in compressive strength, a 48% increase in impact strength, and a 31% increase in storage modulus. However, the coefficient of thermal expansion of the composites exhibited a slight increase compared to the pure phenolic foam. To enhance the bond strength between the GFs and the PR, Kim et al.[38] treated the GFs with a silane coupling agent, which resulted in a 60% increase in the tensile strength of the composites. This demonstrates that treating GFs with a silane coupling agent can effectively enhance the bond strength between the fibers and resin, thereby improving the mechanical properties of the composites.
In this study, boron-modified phenolic resin was employed as the matrix material, with mica, SiO2, and glass powder serving as fillers, and glass fiber utilized as a reinforcing material, to fabricate a series of ceramizable phenolic resin composites. These composites underwent high-temperature treatment in a tubular furnace, and corresponding yields, char rates, solid contents, and high-temperature dimensional stability were calculated. In the content that follows, boron-modified phenolic resin is abbreviated as BPR. The composite material consisting of boron-modified phenolic resin with mica and SiO2 fillers, supported by glass fibers, is abbreviated as BPR/MS/GF. Similarly, the composite material that includes mica, SiO2, and glass powder as fillers, also supported by glass fibers, is designated as BPR/MSG/GF. The thermal conductivity was determined using an HNB-DRS2 type thermal conductivity meter, and thermogravimetric analysis was conducted to analyze thermal weight loss. The impact strength and bending strength of the composites, both before and after high-temperature treatment, were tested using a simply supported beam impact testing machine and a universal mechanical testing machine, respectively. Characterization was performed using Fourier-transform infrared spectroscopy (FTIR), nuclear magnetic resonance (NMR) spectroscopy, field emission scanning electron microscopy (SEM), thermogravimetric-infrared spectroscopy (TG-IR), X-ray photoelectron spectroscopy (XPS), and X-ray diffraction analysis (XRD).