Quality inspection of electronic boards during manufacturing process is crucial step especially in the case of specific and expensive power electronics modules. Soldering splashes occurrence decreases the reliability and electric properties of final products. The aim of this paper is to compare different YOLOv8 models (small, medium, large) with the combination of basic image preprocessing techniques to achieve the best possible performance of designed algorithm. As preprocessing methods contrast limited adaptive histogram equalization (CLAHE) and image color channels manipulation are used. Results show that suitable combination of YOLOv8 model and preprocessing methods leads to increase the recall parameter. In our inspection task, the recall can be considered as the most important metric. The results are supported by the standard two-way ANOVA test.