3.1. Mechanical Properties
Side-wall and bottom specimens of U-profile sheets formed at room temperature (RT), 350 oC, 450 °C, 550 °C, 650 °C, 750 °C, 850 °C and 950 °C were subjected to tensile test at room temperature, and results were plotted in Figure 4. It was observed that the strength and strain were mostly affected fromelevated temperatures. The bottom specimens' strength had higher values on average, around 5-10% at all forming temperatures than sidewall specimens, except RT specimens. It is thought that this difference is because the bottom surface of the punch contacts the sheet earlier than the sidewall surfaces of the sheet during hot forming. So rapid cooling starts from higher temperatures of the bottom surface. Besides, deformation hardening occurs due to compression by punch and die increase at the bottom surface of the blank.
The tensile strengths of the bottom specimens were slightly increased with increasing forming temperature until 850°C. There was obtained a considerable increase in strain and a decrease in tensile strength at 650 °C. After 850 °C, the strength increased dramatically, about 47% until 950 °C. When the true stress-true strain curves of specimens given in Figures 5a and 5b are examined, it is seen that significant strain hardening is observed at bottom specimens compared with sidewall samples. The true stress curve of the sidewall specimens became flat due to the ductile behavior of the material, indicating that the deformation rate is lower than the bottom region. Fig. 4 also shows the total strain results of the specimens. The total strain of the sidewall specimens was significantly higher than bottom specimens with increasing temperature, indicating that the deformation mechanisms vary with the deformation temperature and position of the sheet in the die. The sidewall specimens strain had higher values on average, around 15-33% at all forming temperatures than sidewall specimens, except for specimens formed at RT and 950oC. While a significant increase in strain has not occurred in bottom and sidewall specimens until 850 °C, it has decreased substantially between 850-950 °C. This decrease was about 65% for the sidewall specimens and about 50% for the bottom specimens, indicating that the micro constituents and microstructures varied with forming temperature.
The microhardness change of bottom and side-wall specimens of CP2 titanium hot formed at RT, 350oC, 450 °C, 550 °C, 650 °C, 750 °C, 850 °C and 950 °C is presented in Fig. 6. The hardnesses of bottom specimens were measured as higher than sidewall specimens. The increase was highest at 950 °C with 2%. Temperature-dependent hardness variation was obtained in both side-wall and bottom samples parallel to each other. This showed that the bottom surface specimens had a deformation hardening and rapid cooling effect.
3.2. Microstructures
The microstructure evaluation of the formed sheets was given in Fig. 7. The microstructure images of bottom and sidewall samples are very similar, and consist of equiaxed grains except specimens hot formed at 850 oC. The sheets formed at room temperature consisted of equiaxed α grains exhibiting the same twin bands, and the average diameter of the α phase was in the size of 60-100 µm (Fig. 7a and Fig. 7b). There are numerous carbides, mostly inside grains. It is seen that the microstructure does not change at 350 °C forming temperature at bottom and sidewall samples. Nevertheless, the few recrystallized grains occurrence was observed locally at 450 °C forming temperature at bottom samples. The start of recrystallization in sidewall samples was observed at higher temperatures (550 oC). However, recrystallization is more evident in the bottom wall. This was due to higher deformation rates and higher dislocation density for the bottom wall. Recrystallized grains are uniformly fine (with a diameter of around 20 µm) and equiaxed at these forming temperatures. In addition, twin intersections are seen where the dislocation density is high and the recrystallized grains are fine.
After this temperature, it is seen that the microstructure does not change until 750 °C forming temperature (Fig. 7b, Fig. 7c, Fig. 8b and Fig. 8c). But the number of twins was gradually decreased. Alpha grains were similar to room temperature-formed sheets with an average grain size of 80 µm. At 750 °C, a slightly grain coarsening was seen with grain size 105 µm. The grain size continued to increase at 850 °C. The position and quantity of the carbides were changed and became prominent. Heating above 850 oC caused a noticeable increase in the alpha grain size. Hot forming at 950 °C showed colonies of serrated bright etching α plates and particles of dark etching retained β.
According to the literature [23], beta particles are formed at high temperatures (between 900-950 oC). Because this temperature is the beta transus temperature which alpha grains transform to beta grains, but on the other hand, the presence of acicular alpha is also seen at this temperature.
3.3. Fracture Morphology
In this study, the fracture surfaces of the tensile samples cut from the formed materials at room temperature, 350, 750, 850 and 950 oC were investigated. According to the bottom specimens, dimples are seen at room temperature and 350 oC, representing ductile fracture. At 350 oC, an increase in the number of dimples was observed, and there is elongation in the dimples. Therefore, higher ductility is expected at 350 oC, and according to Figure 8, a higher strain value occurred at 350 oC. There are dimples and voids at 750 oC. In some areas, dimples have become smaller. Voids and small dimples are known to reduce ductility. Indeed, the total strain has dropped at 750 oC in Figure 8. At 850 oC, it is seen that voids are in a state of disappearance. For this reason, the total strain and ductility slightly increased. There are smooth and shiny surfaces at 950 oC, representing brittle failure, and the lowest strain value was also obtained at this temperature. When the temperature increased from room temperature to 350 °C, the dimples were elongated in some regions and the dimples have also increased. This indicates an increase in ductility and Figure 9 supports this. Micro voids are available at 750 °C and have an effect reduces ductility. At 850 oC, dimples became smaller and the ductility decreases. Brittle fractures are observed, and therefore, smooth and shiny surfaces are formed at 950 oC. Because of this reason, the lowest strain value was obtained at 950 oC. The brittle fracture causes low ductility.
Besides, when the macroscopic photographs of the samples given in Figure 10 are examined, ductile fracture type is seen in all samples except the sample at 950 oC.
3.4. Springback Angles
The temperature up to room temperature is found to be effective for reducing the strength. However, the decrease in strength does not mean an increase in formability in this temperature range. The formability results are seen in Table 3. According to the figure, it increased after 350 oC. As known from the literature, Ti has a hexagonal close-packed (HCP) crystal structure with a limited number of slip planes. For this reason, Ti has lower formability at RT, but at high temperatures, the existence of alternative slip systems improves the formability [13]. The findings at high temperatures have supported the mentioned reason. Springback is commonly related to high strength and elastic energy. As the temperature is increased, the strength of the material is also substantially increased, and the high strength of a sheet material indicates the greater the degree of springback.
Table 3. Springback angles of hot formed sheets.
Temperature
|
RT
|
350
|
450
|
550
|
650
|
750
|
850
|
950
|
Angle (o)
|
15
|
12
|
10
|
8
|
9
|
9
|
10
|
11
|