Printed circuit boards (PCBs) are the heart of the communication and electronics industry. Most of time, PCBs are often exposed to humidity leading to the corrosion of printed circuit boards and subsequent failure of the electronic devices[1–5]. Currently, electrically conductive adhesives[6], nanosized Ag paste[7] and carbon nanotubes[8] are the most commonly used packaging materials in the electronics industry. However, traditional packaging materials are not suitable for modern electronic packaging of printed circuit boards because of high conductivity and cost. In general, silicone rubbers coating is widely used in protection of PCBs because of its good dielectric properties, water repellency, ultraviolet durability, excellent chemicals and thermal degradation resistance[9, 10, 11]. Nowadays, solvent-based condensation-cure silicone rubber coating [12] for the protection of PCBs is one of the few commercialized coatings. During the curing process of solvent-based condensation-cure silicone coating, the solvents and small molecules will be released leading to the pollution of the environment and the PCB[13], even the reduction of the reliability and the service life of electronic products.
One-component addition-cure silicone rubber (OLSR) coating has the advantages of low shrinkage, the ability to adjust reaction speed and conditions over a wide range, and the fact that no byproducts or degradation products are formed[14–18]. It can obviously solve the problem caused by the released solvents and small molecules for solvent-based condensation-cure silicone rubber. Although the utility of OLSR coating was accepted, it was not often well satisfied with their applications in the fields of the protection of PCBs due to its storage instability and poor bond strength. Therefore, how to improve the storage stability and bond strength of OLSR coating has become an important direction for the researchers in the field of protection of PCBs.
Thermal-latent hydrosilylation catalyst is crucial for the enhancement of the storage stability of OLSR coating. A typical series of thermal-latent hydrosilylation catalysts consisting of H2PtCl6 and special polymers was developed by Katsuhiko research group[19]. These catalysts were successfully applied in the curing process of silicone resin with high thermal-latent characteristics. Many functional groups including propargyl[20], amine[21], 1-phenylethylisocyanide[22], isocyanide[23] often caused the poison of the platinum catalysts. However, most of these thermal-latent hydrosilylation catalysts are used at a high curing temperature for addition-cure liquid silicone rubber (the curing temperature > 100 ℃), and a low storage temperature (< 10 ℃). They are not suitable for OLSR coating obviously.
For enhancing the bond strength of OLSR coating, an effective way is to incorporate an adhesion promoter on OLSR coating to make it self-adhering when cured on the surface of the substrate. There are a lot of reports devoted to the studies of adhesion promoters. Examples include organosilanes with silylene group as adhesion promoters to adhere silicone elastomers on polyethylene[24]; organosilanes with epoxy group enhancing the adhesion on polyethylene terephthalate[25, 26, 27]; organosilanes with phenyl group and epoxy group enhancing the adhesion on electrolyte membrane[28]; organosilanes with ester groups and vinyl groups enhancing the adhesion on polycarbonate[29, 30]; organosilanes with tetra-tert-butyl titanate enhancing the adhesion on copper, polybutylene terephthalate, polyphenylene sulfide and polystyrene[31]; organosilanes with allyl group enhancing the adhesion to nylon[32]; organosilanes with isocyanurate group enhancing the adhesion on epoxy resin, phenolic resin[33]. However, there are few reports on the addition of adhesion promoter on the addition-cure silicone rubber to enhance adhesion to PCBs.
In this work, cyano groups will be introduced to platinum catalyst (CN-PT) for enhancing the storage stability, and urethane-containing poly(hydromethylsiloxane) (N-PHMS) will be synthesized through hydrosilylation as an adhesion promoter for enhancing the bond strength. Fourier transform infrared spectroscopy (FT-IR) will be used to characterize the chemical structure of CN-PT and N-PHMS.The mechanical properties and curing rate of OLSR coating will be tested in order to obtain optimum content of N-PHMS and CN-PT. The properties including storage stability, bond strength, surface morphology, protective performance of the OLSR coating will be tested to evaluate the advantages of this combination designed OLSR coating for PCBs.