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Research Article
Qiuying Li
East China University of Science and Technology
Corresponding Author
ORCiD: https://orcid.org/0000-0003-1990-2402
License:
This work is licensed under a CC BY 4.0 License. Read Full License
Tetraethyl orthosilicate (TEOS) was used as the silicon source, and polydimethylsiloxane (PDMS) was the organic precursor to modify the surface of glass fiber (GF) through the sol-gel method. The modified GF noted T-GF was filled in PTFE to prepare PTFE/T-GF composites. SEM, FTIR, XPS, and contact angle confirmed that organic-inorganic hybrids were successfully loaded on GF's surface. Compared with PTFE/GF and the conventional coupling agent modified GF filled PTFE composites, the properties of PTFE/T-GF composites, including dielectric properties, mechanical properties, moisture absorption, thermal conductivity, and coefficient of thermal expansion (CTE), enhanced significantly for the improvement of compatibility of PTFE and GF. Moreover, the PTFE/T-GF exhibited improved dielectric constant (2.305), decreased dielectric loss (9.08E-4), higher bending strength (21.45 MPa) and bending modulus (522 MPa), better thermal conductivity (0.268 W/m*K) and lower CTE (70 ppm/℃), making it has promising application as the substrate materials for printed circuit board.
Keywords
PTFE, GF, sol-gel, dielectric property, printed circuit board
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This is a preprint. It has not completed peer review.
Research Article
Qiuying Li
East China University of Science and Technology
Corresponding Author
ORCiD: https://orcid.org/0000-0003-1990-2402
Badges
Prescreen
This manuscript passed our Prescreen assessment
Complete author information
Appropriate declaration statements
Potential risks to human health
Prescreen
History
CURRENT STATUS: Posted
Version 1
Posted 16 Mar, 2021
No community comments so far
Metrics
Comments: 0
PDF Downloads: ...
HTML Views: ...
Subject Areas
Materials Engineering
License:
This work is licensed under a CC BY 4.0 License. Read Full License
Tetraethyl orthosilicate (TEOS) was used as the silicon source, and polydimethylsiloxane (PDMS) was the organic precursor to modify the surface of glass fiber (GF) through the sol-gel method. The modified GF noted T-GF was filled in PTFE to prepare PTFE/T-GF composites. SEM, FTIR, XPS, and contact angle confirmed that organic-inorganic hybrids were successfully loaded on GF's surface. Compared with PTFE/GF and the conventional coupling agent modified GF filled PTFE composites, the properties of PTFE/T-GF composites, including dielectric properties, mechanical properties, moisture absorption, thermal conductivity, and coefficient of thermal expansion (CTE), enhanced significantly for the improvement of compatibility of PTFE and GF. Moreover, the PTFE/T-GF exhibited improved dielectric constant (2.305), decreased dielectric loss (9.08E-4), higher bending strength (21.45 MPa) and bending modulus (522 MPa), better thermal conductivity (0.268 W/m*K) and lower CTE (70 ppm/℃), making it has promising application as the substrate materials for printed circuit board.
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
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