3.1. Characterization of copper granules
The composition of copper granules is shown in Table 1, except 89.63% Cu and 2.03% other impurities, the left metals of Zn, Sn, Pb, Fe, and Al are all leachable with sulfuric acid.
Table 1
Major metals contained in copper granules
Element | Composition(wt%) |
Cu | 89.63 |
Zn | 2.74 |
Sn | 2.05 |
Pb | 1.34 |
Al | 1.15 |
Fe | 1.06 |
Others | 2.03 |
3.2. Effect of the impurities to H2SO4 mole ratio on the leaching efficiency
In the acid-leaching process, the possible reaction equations are shown as follows:
$$\text{Z}\text{n}+{\text{H}}_{2}{\text{S}\text{O}}_{4}=\text{Z}\text{n}{\text{S}\text{O}}_{4}+{\text{H}}_{2}\uparrow (2)$$
$$\text{S}\text{n}+{\text{H}}_{2}{\text{S}\text{O}}_{4}=\text{S}\text{n}{\text{S}\text{O}}_{4}+{\text{H}}_{2}\uparrow (3)$$
$$\text{P}\text{b}+{\text{H}}_{2}{\text{S}\text{O}}_{4}=\text{P}\text{b}{\text{S}\text{O}}_{4}+{\text{H}}_{2}\uparrow (4)$$
$$\text{F}\text{e}+{\text{H}}_{2}{\text{S}\text{O}}_{4}=\text{F}\text{e}{\text{S}\text{O}}_{4}+{\text{H}}_{2}\uparrow (5)$$
$$2\text{A}\text{l}+3{\text{H}}_{2}{\text{S}\text{O}}_{4}={\text{A}\text{l}}_{2}({\left({\text{S}\text{O})}_{4}\right)}_{3}+{\text{H}}_{2}\uparrow (6)$$
The stoichiometric relations of leachable metals mentioned above can be estimated as follows. Take 5.000 g copper granules as the reference, the corresponding moles of leachable impurities are: The mole of Zn nZn =5.000 g×2.74%/65.38 g/mol = 0.002095 mol, the mole of Sn nSn=5.000 g×2.05%/118.7 g/mol = 0.0008634 mol, the mole of Pb nPb=5.000 g×1.54%/207.2 g/mol = 0.0003716 mol, the mole of Fe nFe=5.000 g×1.18%/55.85 g/mol = 0.001056 mol, the mole of Al nAl=5.000 g×0.83%/26.98 g/mol = 0.001538 mol. According the stoichiometric equations (2) to (6), the consumed mole of H2SO4 is NH2SO4 = 0.06 mol/L ×0.1 L = 0.006 mol.
The impurities to H2SO4 mole ratios ranged from 1:1 to 1:5 were investigated to identify optimal condition for acid leaching. In Fig. 1(a), it can be observed that when the impurities to H2SO4 mole ratio was invariable, the leaching ratio of each metal increased with the increase of the operation time, and reached a maximum with the duration of 180 min. Contemporarily, the leaching ratio of each metal increased with the increase of the impurities to H2SO4 mole ratios. The addition of sulfuric acid into the system with molar ratio of impurities to H2SO4 of 1:1 is obtained from their stoichiometric equations, which means the impurities could theoretically be leached completely, but the experimental results showed that is not the case even with the molar ratio of 1:2 and 1:3. This might be attributed to the adsorption of hydrogen on the surface of the metal, forming a chemical equilibrium so that the reaction cannot be carried out to the end. In addition, the decrease of H2SO4 concentration kinetically extended the redox reactions. When the time was the same, the leaching ratio of zinc gradually increased with the increase of impurities to H2SO4 more molar ratio. This might be owing to the fact that the higher concentration of H2SO4 multiplies the number of protons within the solution and displaces more metal cations. Since the percentage of activated molecules of the reactants was certain at the same temperature, increasing the concentration of H2SO4 provided activated molecules, leading to a larger number of effective collisions of molecules per unit time, so the chemical equilibrium shifted to the right and more impurities were leached. The same trend is observed in Fig. 1(b)(c)(d). Considering the leaching ratio of metal ions and the consumption of sulfuric acid, the concentration of H2SO4 of 2.0 mol/L was chosen as the optimal leaching concentration, under which 98.21% Zn, 95.48% Sn, 99.37% Al, and 96.52 Fe were leached after180 min.
3.3. Effect of the temperature on the leaching ratio
The effect of the leaching temperature ranged from 40 to 80°C on the leaching ratio is shown in Fig. 2, with the conditions as the mole ratio of impurities to H2SO4 of 1:4, the leaching time of 240 min and a liquid-solid ratio of 20 mL/g. From Fig. 2(a), it can be seen that at the same leaching duration, the leaching ratio of zinc increases with the increase of temperature. This was probably due to the fact that increasing the temperature caused the desorption of the hydrogen adsorbed on the metal surface. As the hydrogen decreased, the chemical equilibrium shifted to the right and more of the metal was leached. What’s more, by increasing the temperature, the reactant molecules gain energy to activate the original lower energy molecules. As the percentage of activated molecules enhances, the effective number of collisions was enlarged, so the reaction ratio increased. The same trend is observed in Fig. 2(b)(c)(d). Based on the leaching ratio of metal ions and the consideration of energy consumption, 70°C was chosen as the optimal leaching temperature. Under this condition, 98.88% Zn, 96.19% Sn, 99.75% Al, and 97.44% Fe were leached after 180 min.
3.4. Effect of the liquid-solid on the leaching ratio
The effect of the liquid-solid ratio ranged from 5 to 25 mL/g was investigated. The leaching ratio of Zn increased continuously as the liquid-solid ratio increased until the zinc is almost completely leached, as shown in Fig. 3. A reasonable explanation to this phenomenon is that H2SO4 in solution is in its ionization equilibrium because of its secondary ionization constant. At the same amount of H2SO4, increasing the liquid-solid ratio is equivalent to diluting the solution, which will have an effect on the secondary ionization of sulfuric acid. The larger the liquid-solid ratio is, the more complete the sulfuric acid ionization is, which means more H+ ions participate the leaching process. In order to decrease reagent consumption and improve leaching efficiency, 20 mL/g was adopted as the optimal liquid-solid ratio.
3.5. Effect of acid leaching pretreatment
The accumulation of impurity ions in the electrolyte was investigated with the electrolytic conditionsas the concentration of CuSO4 of 60 g/L, the concentration of H2SO4 of 122.5 g/L, and the current density of 40 mA/cm2, which is shown in Fig. 4. Within the electrolysis duration of 1440 min, if the copper granules without acid leaching pretreatment, the concentration of Zn2+, Sn2+, Fe2+, and Al3+ increased from 248.5 mg/L to 1328 mg/L, from 193.2 mg/L to 1057 mg/L, from 153.8 mg/L to 835.6 mg/L, and from 137.1 mg/L to 728.1 mg/L respectively in the electrolyte. In contrast, refining copper granules pretreated by acid with the same conditions, the concentration of Zn2+ increased from 9.941 mg/L to 58.42 mg/L, Sn2+ from 7.728 mg/L to 41.67 mg/L, Fe2+ from 5.482 mg/L to 30.95 mg/L, and Al3+ from 4.631 mg/L to 24.53 mg/L. The impurity concentrations were much lower than those without acid treatment, which indicates that the purpose of acid leaching to remove impurities was satisfied.
In Fig. 5, the variation of the purity of the copper refined by electrolysis with the conditions as the concentration of CuSO4 of 60 g/L, the concentration of H2SO4 of 122.5 g/L, and the current density of 40 mA/cm2 is shown. With the electrolysis lasting from 0 min to 1440 min, the purity of the copper electrolyzed from copper granules without acid pretreatment decreased from 99.32–94.53%, and this shared the same trend with Fig. 4. In contrast, the purity of the copper electrolyzed from the acid pretreated copper granules hardly decreased under the same conditions, only from 99.98–99.73%. Taking 99% purity of copper as a reference, the electrolysis may last 5050 min, if copper granules were pretreated with acid, while it only can maintain 390 min, if the sample without acid leaching, which proves that acid leaching can nearly 13 times prolong the service life of the electrolyte solution.
In Fig. 6(a), it can be seen that the structure of the electrolytic copper obtained from the copper granules after the acid treatment is the classical continuum dendritic structure. In contrast, the structure without acid treatment is a granular structure of varying sizes(Fig. 6(b)). EDS mapping analysis(Fig. 6(c)) shows, these impurities (Zn, Sn, Al) are widely distributed on the surface of the particles, which affects the formation of the copper foil. The presence of impurity ions seriously reduces the diffusion rate of copper ions in the electrolyte resulting in the excessive local growth of copper grains on some sites of the cathode rather than homogeneously reacting, which can be confirmed by the increasingly rough and undulate in Fig. 6(b). In addition, the polarization produced by impurity ions is also adverse to copper deposition.