Manufacturing problem solving methodology analytic. A case study of leakage current in a production company

doi:10.21203/rs.3.rs-2335136/v1

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Manufacturing problem solving methodology analytic. A case study of leakage current in a production company

https://doi.org/10.21203/rs.3.rs-2335136/v1

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Product end-user and customer satisfaction are critical for the success of organisations. This paper presents a case study of a design company and manufacturing supplier that faces customer complaints due to defective temperature sensors integrated into fridge freezers. This research aims to find the root cause of the issues and implement a solution to the problem and to ensure that prevent its recurrence by implementing the lean eight disciplines methodology as an analytics step: (1) 5 Whys analysis based on cross-functional team finding, (2) problem descriptions confirmation, (3) containment actions, (4) root cause analysis of occurrence, (5) permanent corrective actions, (6) implementation of permanent corrective action, (7) actions to prevent a recurrence, and (8) closure with eight disciplines report and congratulate cross-functional teams from the design, engineering, and suppliers production sites.

High-quality product design, development, production processes and manufacturing require a problem-solving framework for the life cycle assessment. This study develops the Eight Disciplines (8D) investigation tool for cross-functional teams, internal and external work together to solve issues to improve the product life cycle in the field. Shows how to conduct root cause investigation analysis of issues with five whys of the problems for crucial processes. If necessary, integrate the 8D, and Six Sigma approaches to identify answers. It enables corrective and preventive actions and customer reports with executed fixes and measures timelines to prevent similar issues from recurring in businesses. This study deals with product managers and practitioners of manufacturing and product design companies using the 8D analytics tool and framework to solve problems for quality improvements throughout the life cycle of products.

For manufacturing problem-solving, use 8D tool analytical challenges (e.g., high warranty cost, high production failures, the unreliability of products, resources, and different scopes) and opportunities (e.g., to solve product issues, improve production processes, and reduce warranty cost). In this case study, a circuit is susceptible to leakage current, cleaning all components following solder assembly. Specific solvents are needed to effectively clean boards because "no-clean" solder flux is used, which does not require cleaning. Therefore, different flux chemistry is necessary for this situation, which can be cleaned using a water-based solvent as a long-term fix, as revealed by the 8D analytics template.

Analytic

Lean Eight Disciplines Methodology

Five Whys Analysis

Root Cause Analysis

Corrective Action

Lessons Learned

Problem Solving Method

This paper presents a manufacturing case study investigating temperature sensor failures' root cause using lean eight disciplines methodology analytics to an actual production floor process issue. Future applications can be adapted using the eight disciplines framework for the root cause investigation for problem-solving and lean eight disciplines methodology template to other companies in many industries by implementing critical variables in their contexts.

Problem-solving analytics is critical for the manufacturing industries to produce many defects and Waste, all those products or process failure which does not add value for the customer (Razali & Rahman, 2020). According to the literature review, product defects waste categories are overproduction of the units, dead inventory, not using the lean manufacturing frameworks, the motion of sub-assemblies in sub-suppliers, waiting for shipments, transportation hubs to central warehouses for stock, and product defects (Jadhav et al., 2008) negatively impact products and unit cost to the customers. Production defects come from product manufacturing process failures, or the raw material supplied by the suppliers. Many defects remain present in all sectors' product design and manufacturing processes. Many authors have described product defects as the main cause of the high warranty cost or the damage in final products or components supplied for the suppliers, which has worsened due to the post Covid19 supply chain issues from the far east to all manufacturing sectors.

Customer satisfaction and product quality are core requirements of the ISO 9001:2015 standard (BSI, 2015) for all organisations to remain globally successful (González-Reséndiz et al., 2018). It is the product management, design, engineering, supply chain, service, and manufacturing teams' responsibility to fulfil technical product requirements and customer specification needs and ensure changes in the product design and production processes. All product design issues lead to dissatisfaction among the customers and end-users, which leads to sales decreases and health and safety issues requiring product recall. Therefore, all manufacturers must improve the effectiveness of the solutions and efficiency in the production processes for quality assurance using the lean six sigma framework based on the DMAIC (Define, Measure, Analyse, Improve, and Control) process (Wang et al., 2019). And using the PDCA (Plan, Do, Check, Act) cycle of the ISO 9001:2015 (Dudin et al., 2014) and the Lean 8D method (Rathi et al., 2021; Wang et al., 2019). The 8D methodology is sometime called as Ford TOPS 8D, this method was first developed and implemented by Ford Motor in 1980’s (Kaplík et al., 2013) by the cross-functional team known as Team Oriented Problem Solving (TOPS). Its powerful tool which adopted and implemented in the automotive industry and still used for problem solving, (BANICA & BELU, 2019a) which companies still keep using 8D till today.

Company S has also noted that the problem only appears to be associated with devices which was manufactured in a certain location. The devices are manufactured in Thailand and China, and only devices from the Chinese manufacturing site have exhibited faults. Therefore, Company S has started to learn Eight Disciplines (8D) investigation analytics of devices from the Chinese-manufactured site that has exhibited the fault, along with comparative devices from the Thailand-manufactured site. The lean 8D (CHOMICZ, 2020) methodology analytics help to identify the root causes of a problem and permanent solution to solve them, which according to the International Automotive Task Force IATF 16949: 2016 (Pauliková, 2022)which is automotive quality management system standard, used in the automotive industry for service to solve customers’ issues and concerns of suppliers to ensure products quality, process deviation solutions and customer complaints. The 8Ds method is widely adopted in all manufacturing sectors (Kumar & Adaveesh, 2017) and industries worldwide.

Root Cause Analysis (RCA) investigation analytics are used to determine the root cause of the failures based on the following samples that were supplied to find failures; a list of serial numbers is shown in Table 1: Product Serial Numbers.

Both manufacturing suppliers use many different techniques for solving manufacturing problems in production lines. This research paper reports a case study used in manufacturing companies in Thailand and China to manufacture the fridge-freezer temperature controller and sensor unit. An overview of the device is shown in Figure 1: FCR Sensor Overview and the location of the MLCC (PCB Component C11) that is the subject of this investigation is indicated by the arrow in Figure 2: Location of the affected capacitor.

Each device goes through many tests to assure quality using computer-aided programs for inspection checks. Such a production process allows for building good quality products. Sellers and end users have lately experienced defects reported by the customers about 2000 returned temperature sensor units. The MLCC was a 406-package size component, rated at 1µF and 25V. The potting material's insulation resistance in the China and Thailand-manufactured devices was measured using a Megger insulation test meter. Many case studies in the manufacturing sector done using Value-Stream mapping (Acero et al., 2019; Razali & Rahman, 2020), lean Sigma (Kaswan & Rathi, 2020; Wang et al., 2019), and the plan-do-check-act (PDCA) cycle of the ISO 9001:2015 framework (Realyvásquez-Vargas et al., 2018) to mention few. This research implements the single case study approach. The key reason is that it allows a positive impact of the lean 8D methodology analytics for the product PCB board manufacturers to reduce defects of the manufacturing processes with a single case study. The resistance across ~ 2mm distance across the surface of the potting material was measured at 1000V, and the insulation resistance was >200 GΩ Ohm for both sample sets of sites.

The potting material was gradually removed from a selection of devices until the capacitor was revealed. Potting material adjacent to the base of the capacitor had a different appearance to the bulk material, as shown in Figure 3: Potting material adjacent to MLCC – China Unit, and Figure 4: Potting material adjacent to MLCC – Thailand Unit.

The potting material had a black glassy appearance. The difference was more pronounced in the samples from the China manufacturing site, as compared with samples from the Thailand manufacturing site, where the red arrow indicates the potting material that has been in contact with the capacitor. This paper contributes towards a single case study, and an easy SEM technique can be used to improve a production process failure and detective solder flux contamination.

The rest of the paper is divided into the following sections:Section 2 is for the literature review about the 8D method; Section 3 reports the potting material Fourier Transform Infra-red (FTIR) analytics; Section 4 addresses the Lean 8Ds analytic finding of the potting materials; Section 5 shows the findings of the Scanning Electron Microscopy (SEM) analytic and production floor soldering processes analytic; and finally, Section 6 presents the conclusion for manufacturing companies and 8D analytic solution for industrial implementation, as shown in Figure 5: Lean 8D Framework.

The 8Ds is a cross-functional platform for problem solving method analytics that aims to find out the root cause of failure problem to solve it using corrective action guided procedure (Chen & Cheng, 2010a). The 8D method (is known as G8D, Global 8D, TOPS 8D) was developed at Ford Motor Company, it was introduced in 1987 to manual entitled “Team Oriented Problem Solving”(TOPS) (Joshuva & Pinto, 2016). Since then, its widely used in auto-motive, aerospace, consumer electronics, and maritime sectors to solve product and production problems. According to Bremmer (Bremmer, 2015) applied the 8Ds method analytics to analyse the Scania global supply chain issue of how company could guarantee the quality of products as required, At the end, the author was able to found problem and its root causes, which were solved. It’s one of the most used problem-solving tool to solve non-conformances, reoccurrence prevention in the manufacturing, service, and production factories globally.

Implementation of lean Pacheco-Pacheco (Pérez-Pucheta et al., 2019; Škůrková, 2017) was able to optimize delivery times of alternation clothing in the tailor shop using 8D method. End result was reduction in production time by 21% and delivery time was decreased by 33.33%, which is great for the customers. Similarly use the 8D method (Zasadzień, 2017) to reduce the preventive maintenance downtime of the production processes machines change over time, simply by making production batches changes, which caused the bottlenecks in the production floor. Implementation of quality system (Škůrková, 2017) such as 8D to reduce the scrap costs in the industrial company, the author implemented series of production quality control methodologies including 8D method to find the root causes of the scrap costs and then implemented corrective actions to reduce costing drivers. The 8D method is used to reduce customer complaints and solve quality issues, which is further enhance by using the 5W and 2H approaches to overcoming the quality of the issues (BANICA & BELU, 2019b) due to the cause and effects of the failure modes to solve automobile power painting errors, which assist in root cause analytics. Impact of (Rani et al., 2019) using 8Ds method (Sharma et al., 2020a)to find the flux from the wheels and improving the cycle time are implemented for determining the root cause of productivity and value stream mapping has improve production quality. As shown in this paper the production flux cross contamination is the root cause of the failures which is solved by using the 8D method. Customers complaints are solved (Chen & Cheng, 2010b) using the 8D approach to solve the sheet metal hardness factor for the customer needs, hardness was decreased from 28 percent to 0.5 percent and company saved $ 22 million. Other manufacturing companies adopted following problem-solving techniques in their toolkit. As shown in Table 2: Problem-solving tools.

The following case studies are used to validate these problem-solving techniques;

Six Sigma - (Reddy Gangidi, 2019; Sharma et al., 2020a; Singh et al., 2021)
TQM - (Cao et al., 2000; Citybabu & Yamini, 2022; Esaki, 2016)
8D - (Praveen S. Atigre et al., 2017; Rathi et al., 2021; Sharma et al., 2020a)

The automotive sector have supply chain globally interconnected with high level of network production floors, requires interchange of quality information throughout the whole product life cycle, including service phase, (Adams & Granic, 2008; CHOMICZ, 2020; Kaswan et al., 2020) for the customers. It is critical to use effective problem-solving tools for the end-users or customers complaints management and for managing the internal nonconformities handling. The 8D platform provide that problem-solving framework, Utilizing ISO 9001 (BSI, 2015; Pauliková, 2022) tools and methods from several PDCA (Plan-Do-Check-Act) cycle-based problem-solving methodologies, 8D uses a composite methodology to solve problems, as shown in Figure 6: 8D problem-solving PDCA cycle.

As a result of successful implementation of the 8D method cross many sectors which mean its commercialization, allows ask suppliers for the 8D reports in cases of random errors, when is requires to find out the underlying root cause of the failures and random effects in the process cannot be removed. The 8D methodology was found to be so effective and easy to implement in the manufacturing and service sectors, it is officially nominated as the key source of the RCA investigation in the documentation for problem-solving at the Ford motors and it is still in used today. Many other manufacturing companies have adopted this technique in the toolkit for the investigation issues (González-Reséndiz et al., 2018; Singh et al., 2021). Some of the case studies are presented in the Table 3: 8D methodology implementation case studies.

It’s critical to identify all relevant information on the production process by applying different analytics, which supports decision-making for the 8D investigation to improve manufacturing processes. According to (Realyvásquez-Vargas et al., 2020), “The 8Ds methodology can be used to solve any problem and issues for the customers using the cross-functional teams with effective communication among the departments across all sites, as done in this case with both suppliers’ sites in China and Thailand.

Therefore, the lean 8D method is the best tool to use to solve a quality problem, which is based on the Quality-One Eight disciplines following steps:

Customer complaints
Compliance requirements or product design safety issues
Internal Audit findings Non-Conformance, production batch rejects
High warranty issues and production floor high failure rate due to process failure

The “black” potting material adjacent to an MLCC from a China-manufactured site unit was further analysed using the Fourier Transform Infra-red (FTIR) analytic spectroscopy and compared against the FTIR spectrum of the bulk potting material, as shown in Figure 7: FTIR analytic of potting material.

No additional peaks were identified between the two samples implying that no organic contamination was detected. However, it should be noted that the detection limit of FTIR may be several per cent by weight composition (depending on the material type used). Therefore, this test analytics may not identify low levels of contamination. It was noted that the relative peak heights differed between the two samples, as indicated by an arrow. This difference may be caused by a difference in the degree of crosslinking during potting material cure.

After removing most of the potting material, the external condition of the MLCC was found to be good. The solder fillet was well formed, and the quantity of solder was appropriate for this type of device (excess solder can place undue mechanical stress on the component and increase the likelihood of crack formation of the capacitor). There was no external evidence of cracks in the component. The PCB tracks to the capacitor were cut to isolate the component from the rest of the circuit, and electrical measurements were made of capacitance and resistance across the component. The capacitance was measured at ~970nF. The electrical resistance was measured using a Sefalec Megohm resistance meter at voltages between 1Vdc and 10Vdc. There was no evidence of electro-migration across the surface of the MLCCs. Electro-migration of metals across the surface of MLCCs under permanent DC bias can occur, resulting in high leakage of current and could end up a short circuit of the unit, but that had not occurred in these samples. The resistance was relatively constant in the range of 1x10³MΩ, and the resistance did not decrease with increasing test voltage. One of the MLCCs was mechanically removed from the PCB by cutting the solder connection to allow inspection of the underlying PCB surface. There was no evidence of electro-migration of metals across the surface, as shown in Figure 8: MLCC underside PCB surface inspection.

Lean 8D template consists of Five Whys findings before 8Ds with the lesson learned checks to validate solution effectiveness according to ISO 9001:2015. The quality issue is the temperature sensor controller freezing failure, causing the problem for the bottle coolers of customers. 5 Whys and 2 How steps are shown in Table 4: 5Whys and 2How. The Ishikawa diagram supports the finding of the 5W and 2H map causes (Rathi et al., 2017).

D1 – Problem description

Several failed units have been returned to the manufacturer for investigation, which has identified that the problem is related to C11, a 0402 MLCC used as a filter capacitor on the probe input circuit. These capacitors appear leaky or have low resistance causing a DC shift in the probe measurement, which causes a shift in the temperature. However, after removing a potting material around C11, the current leakage reduces, and sensor performance improves.

D2 –. Problem defective units

Two PCs of defective units and One PC of the good unit from the same production batch were returned to the Manufacturing site in China for further investigation, testing analysis and correction action to make improvements. Following customer return Units SN1 and SN2 were shipped to the factories for the 8D investigation.

Returned Unit 1 SN 1
Returned Unit 2 SN 2
Good Sample Unit

D3 – Containment action

Suppliers got two days after receiving the complaint to take containment actions; in this case Manufacturer site – in China checked and confirmed the following steps:

Semi-Finished Goods: No semi-finished goods are on the production floor or lines.
Finished Goods: There are not any finished goods in the warehouses.

D4 – Root cause analysis (RCA)

Suppliers and sub-assembly manufacturers need to investigate defective units after receiving complaints from the customers and should complete failure investigation analytics. In this case, the manufacturing site in China has confirmed the following RCA finding of the good and defective units. Tested the goods and returned the sample unit to the tester to check and validate it. The unit has passed all functional tests, as shown in Figure 9: Manufacturer Tester Platform.

Tested defective returned units SN1 and SN2 into the production floor tester for testing, respectively, rotating knob to scale 2,5,8. The relays cannot be converted, and the final test results were Fail, as shown in Figure 10: Test Failure

Always measure the resistance between T8 and T9 on the returned samples. However, the resistance of returned sample SN1 has decreased, but the resistance of returned sample SN2 is normal compared to a well-known sample unit.

Further, analyse the reason behind the decrease in resistance of both returned SN1 & SN2 units. Removed the bottom case of the unit and potting material so that cap C11 is exposed and resistance between T8 and T9 is found abnormal, which was fixed after replacing with the new capacitor C11. Then measured, the original capacitor with LC meter was based on the datasheet specification (1uF±10%/25V), and the value is correct. No crack was found on the capacitor, as shown in Figure 11: C11 MLCC Failure.

The production engineering team reviewed the manufacturing production process of week 19 of 2019. All production processes were the same as the first production batch, which confirmed that no Engineering Change Order was implemented in the production units. This suspected cause may be contamination of the PCB surface near the cap C11 of both returned SN1 and SN2 Units.

D5 – Permanent corrective action

The supplier has confirmed that solder paste OM338PT is fit for the 0402 sizes SMT components, and there is no need to clean the flux residue on the PCB boards as a normal process. This used solder paste meets the no-clean requirement according to the IPC standard. The flux contamination issue requires deep clean-up of the SMT line before and after the production batch, and once a week, the flux material can be used to zero the contamination risk for the units. Therefore, this Preventive action change is implemented in the SMT production process as a clean-up of the SMT lines.

D6 – Implementation of permanent corrective action

Test both returned samples SN1 and SN2 units into the tester rotating knob positions from 2, 5, and 8 to check the relay current level and the C11 current. Both returned units Pass the functional test after replacing the capacitor C11, as shown in Figure. Solder paste SMT line clean-up change was implemented as a corrective action on the production floor, as shown in Figure 12: Functional Test Pass. After the functional test, both units relays operates normally, and the final test result is PASS, so the reprogramming with the latest software of units.

This functional test is effective for detecting faults in the units with low resistance across the C11 and to valid the firmware issues, so this type of failure are solved in the manufacturing. During the functional test, the tester was able to detect failure with 2.7MOhm resistor fitted in parallel with T8 and T9 terminals to simulate, when there is a low resistance across cap C11.

D7 – Actions to prevent the recurrence

Implemented 100% check of the resistance value between T8 and T9 terminals as a part of the final test for the sensor units with a multi-meter after the potting process in all next batches.

D8 – Closure 8D report

Closure lean 8D reports findings details of the RCA analysis and Correction actions details are shared with customers to ensure quality assurance and offer them new replacement units FOC (Free of Cost) under warranty.

The potting material adjacent to the MLCCs from the Thailand and China manufacturing sites was assessed by Scanning Electron Microscopy with energy-dispersive X-ray analysis (SEM-EDX). As shown in Figure 13: SEM analytics of potting, the defective potting material is from the China manufacturing site. The dashed red box indicates the outline where the material was in contact with the MLCC. This is a backscatter SEM image where lighter greyscale levels indicate higher atomic mass material. EDX analysis was made at the numbered regions 1-4 results.

The EDX results show the weight percentage of elements at the surface of the potting compound that was in contact with the MLCC. Most of the material was carbon and oxygen (as expected for a polyurethane material), along with aluminium which was probably alumina filler material of the soldering process and, therefore, electrically insulating.

There was a significant amount of tin, including in area 3, at the base of the capacitor at the interface with the PCB. The tin spanned the entire length of the MLCC (as indicated by the red arrow in Figure 13), and it would have been bridging between the MLCC terminals.

The following Table 5 shows SEM-EDX analytic results of the potting material surface to MLCC of the China Unit.

As compare Figure 14: Shows an equivalent SEM image from the MLCC from a Thailand manufacturing site, and the EDX analysis results are shown in Table 3. In this sample, there was also Tin present adjacent to the MLCC. However, the amount of tin was less than the sample from the China manufacturing site, and the tin did not create a bridge for the entire length of the MLCC (as indicated by the red arrow in Figure 14).

After the removal of the potting material, abnormal leakage current across the MLCCs was not measured. The likely root cause of the device failure was leakage of current across the MLCC because of the solder flux and tin residues on the PCB board. The lead-free solder flux used in manufacturing these PCBs was no clean solder flux composed of isopropyl alcohol and glycol. However, other PCB surface contaminants, including tin residues, may have been present following solder assembly. As a production process change, the final solution is changing the potting process into two steps to reduce the risk of contamination and air bubbles, as explained below:

Place products onto the fixture of the dispensing machine.
First time, use 7g of epoxy on each product for dispensing time of 8 to 15 seconds each.
Place potted products on task for a curing time of 6 hours.
Place potted products onto the fixture of the dispensing machine.
Second time, use 11g of epoxy on the product for dispensing time of 12 to 18 seconds each
Place the potted products on the rack for a curing time of 12 hours min.

The change in the potting process is implemented as the final solution to solve this current MLCC leakage issue. Technical requirement of the potting process change is explained in the ECO (Engineering Change Order), as shown in Figure 15: Potting Process Change.

Therefore, solder flux residues can affect the adhesion and curing of potting compounds. Potting compounds generally require a clean PCB surface to allow correct adhesion to the PCB surface. In this case, the potting material cure adjacent to the surface mount components may have been affected by the presence of solder flux residues, which is a source of contamination.

6.1 Lean 8Ds analytic template

The Lean 8Ds analytics template (Praveen S. Atigre et al., 2017)can be used by manufacturing and industrial organisations to solve the end users and customers’ complaints due to product design and manufacturing issues, as shown in Table 7: 8D Analytics Template.

The 8D problem-solving framework provides a cross-functional team to work together with all levels of detail to resolve issues. The key steps are the Root Cause Analysis of the problems and the 5Whys of the issues using the cause and effect to find solutions, if required, using a combined approach of 8D and Six Sigma(Sharma et al., 2020b). It allows us to take Corrective and Preventive Actions and customer reports with implemented corrections with a measured timeline to avoid similar problems repeating again in the organisations. This case study encourages manufacturing and product design organisation managers and practitioners to embrace the 8Ds analytics framework used for quality improvements.

6.2 Recommendations

As the circuit is particularly sensitive to MLCC leakage current., it is recommended that the design, engineering, and production teams ensure that all PCBs are cleaned following solder assembly. “No-clean” solder flux is not intended to be cleaned, and specific solvents are required for effective cleaning. Therefore, there is a need for the 8Ds analytics template to find out the different flux chemistry required, which can be used to clean with a water-based solvent as a permanent solution in this case.

Returned Unit 1 SN 1
Returned Unit 2 SN 2

Permanent Corrective Actions for Returned Unit 1, SN 1

As explained, the solder paste supplier (ALPHA) has confirmed that the solder paste OM338PT is the correct type to use for the 0402 size components like MLCC in this case, and there is no need to clean flux residue on the PCB boards as normally. Nevertheless, the production engineering team follows the IPC620 standards, which require cleaning of the flux residue. Therefore, change the process analytics to start cleaning up flux residue before the potting process to ensure no contamination is left on the MLCC.

Permanent Corrective Actions for Returned Unit 2, SN2

The failure was found to be a software installation issue and not manufacturing-related. Design and software engineering teams can create to Firmware installation kit to overcome this issue.

Verification of the effectiveness

An additional detection step for the production floor is to measure the resistance value between T8 and T9 terminals with a multi-meter after-potting process for the frequency of 5PCS /2Hrs.

The 8D problem-solving process is a detailed, cross-functional problem solving template used to solve manufacturing, product design, service, and production process issues in the factories and sub suppliers supply chain to protect customers and implement corrective actions. Factories and manufacturing firms needs to operate effectively for the sustainability controls and reduce cardon footprint and reduce wastes defectives because of government policy and environmental impact, which is parts of the Paris Pact and the 2030 Agenda for Sustainable Development. The Paris Agreement formally recognizes need to implement global solutions to reduce global warming impacts of the manufacturing factories and this paper provide solution towards this great good cause to all manufacturers.

Acknowledgments

The author would like to thank and be grateful to all of the reviewers for their efficient handling and the valuable comments for improving this research on earlier versions of the paper.

Data Availability Statement

All data underlying the results are available as part of the article, and no additional source data are required.

Funding

The author declares that no funds, grants, or other support were received during the preparation of this manuscript.

Conflict of Interest

The author declares that there is no conflict of interest.

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Table 1: Product Serial Numbers

Manufacturing Suppliers Sites	Thailand	China
Units Serial Number (s)	4778694999 4778695004	4906913946, 4796134553, 4906935146, 4906915377, 4906915425, 4906914968

Table 2: Problem-solving tools

Concept	Origin	Aim	Focus	Method
Six Sigma	Motorola (1987)	Improve process capability	Reduce variations in process inputs	Lesson learn use to implement change
Total Quality Management (TQM)	Japan Panasonic (1990s)	Improve quality and processes control	Customer Complaints Management	Resources matrix of consumption, vogue results.
8D	Ford Car (1980s)	Solve complex problems	Reduce failures and implement solutions	8D methodology Implemented

Table 3: 8D methodology implementation case studies

Authors	Companies	Problem-solving with 8D methodology
(Behrens et al., 2007)	Ford and sub- Suppliers	The 8D methodology first started at the Powertrain part of the Ford automotive group. A cross-functional Team Oriented Problem Solving (TOPS) has implemented which has solved the issue in the Powertrain factory and sub suppliers supply chain as well, due to the success of it, this problem solving framework is implemented in all Ford business groups.
(Kumar & Adaveesh, 2017)	Valve Spring Manufacturing	The 8D problem-solving technique is used to find root cause of the 17% rejection rate of the Valve Spring in manufacturing, which is reduce to 4.91% by making the pitch distance equal at the begin-end side of the Value.
(Realyvásquez-Vargas et al., 2020)	Electric Cable Manufacturing company	Customer complaints about defectives of custom cable assemblies which integrated in an engine. The 8D method is used to develop a software tool for the production floor to conduct functional test on the assembly lines, which has decrease the number of defective products by 75%.

Table 4: 5 Whys and 2How

This temperature controller freezing issue has occurred in many countries.
Who	Head of Quality of the manufacturer with both suppliers' sites
What	The freezing issue needs to be solved.
When	Production batch of 2019 units
Where	Lean 8D investigation report
Why	C11 failure due to access Flux contamination of potting material
How	Production floor failure causing issues in the field
How many	10 PCs returned back to the UK out of many field failure cases

Table 5: SEM-EDX analytic of potting material surface – China unit

Spectrum Label	1	2	3	4
C	69.00	65.34	73.92	67.06
O	28.35	26.23	12.95	29.32
Na	0.07	0.17	0.00	0.09
Al	0.88	2.17		1.39
Si	0.12	0.19		0.11
S		0.08
Ca	0.19	0.38
Sn	1.39	5.44	13.13	2.02
Total	100.00	100.00	100.00	100.00

Table 6: SEM-EDX analytic of potting material surface – Thailand

Spectrum Label	1	2	3	4	5
C	62.64	68.89	69.28	66.40	57.54
O	34.78	25.89	28.79	27.20	35.27
Na	0.07	0.14	0.14	0.16
Mg		0.18		0.06
Al	1.75	0.96	0.73	0.40	5.63
Si	0.13	0.39	0.15	0.15	0.45
P		0.16		0.14
Cl			0.06
K					0.16
Ca	0.14	0.14	0.13		0.44
Sn	0.48	3.23	0.72	5.49	0.50
Total	100.00	100.00	100.00	100.00	100.00

Table 7 is available in the Supplementary Files section.

No competing interests reported.

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Manufacturing problem solving methodology analytic. A case study of leakage current in a production company

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Abstract

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Highlights

1 Introduction

2 Literature Review Of 8ds Method Analytics

3 Potting Material Fourier Transform Infra-red Analytic

4 Use Five Whys Analysis, An Integrated 8ds Analytic

D1 – Problem description

5 Scanning Electron Microscopy (Sem) Analytic

6. Evaluation Of Findings And Conclusion

Declarations

References

Tables

Additional Declarations

Supplementary Files

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