[1] J. He, T. Zhao, J. Xin and N. Demerdash, International Conference on Renewable Energy Research and Application, IEEE (2015) https://doi.org/10.1109/ICRERA.2014.7016485.
[2] A. Morya, M. Moosavi, M.C. Gardner and H.A. Toliyat, International Electric Machines and Drives Conference (IEMDC), IEEE (2017) https://doi.org/10.1109/IEMDC.2017.8002288.
[3] K.C. Reinhardt and M.A. Marciniak, IECEC 96. Proceedings of the 31st Intersociety Energy Conversion Engineering Conference, IEE (1996) https://doi.org/10.1109/IECEC.1996.552858.
[4] M. Hoshi, 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Prague (2016) https://doi.org/10.1109/ISPSD.2016.7520765.
[5] J. Barcena, J. Maudes, M. Vellvehi, X. Jorda, I. Obieta, C. Guraya, L. Bilbao, C. Jimenez, C. Merveille, J. Coleto, Acta Astronaut. (2008) https://doi.org/10.1016/j.actaastro.2008.01.010.
[6] J. Broughton, V. Smet, R.R Tummala, Y.K. Joshi, J. Electronic Packaging (2018) https://doi.org/10.1115/1.4040828.
[7] Z. Liang, 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP), IEEE (2015) https://doi.org/10.1109/IWIPP.2015.7295970.
[8] R. Khazaka,L. Mendizabal, D. Henry, R. Hanna, IEEE T. power Electr. (2014) https://doi.org/10.1109/TPEL.2014.2357836.
[9] B. Mouawad, C. Buttay, M. Soueidan, H. Morel, F. Mercier, 2012 24th International Symposium on Power Semiconductor Devices and ICs, Bruges (2012) https://doi.org/doi: 10.1109/ISPSD.2012.6229081.
[10] K. Hromadka, J. Stulik, J. Reboun, A. Hamacek, Procedia Engineering (2014) https://doi.org/10.1016/j.proeng.2014.03.107.
[11] J. Hlina, J. Reboun, A. Hamacek, Scripta Mater. (2020) https://doi.org/10.1016/j.scriptamat.2019.09.029.
[12] J. Schulz-Harder, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, IEEE (2006) https://doi.org/10.1109/STHERM.2006.1625233.
[13] S. Zhang, L. Yan, K. Gao, H. Yang, X. Wan, Ceram. Int. (2019) https://doi.org/10.1016/j.ceramint.2019.04.186.
[14] I.B. Krasniy, A.A. Denisova and S.A. Kumacheva, 2016 13th International Scientific-Technical Conference on Actual Problems of Electronics Instrument Engineering (APEIE), Novosibirsk, (2016) https://doi.org/10.1109/APEIE.2016.7807089.
[15] J. Jarrige, T. Joyeux, J.P. Lecompte, J.C. Labbe, J. Eur. Ceram. Soc. (2007) https://doi.org/10.1016/j.jeurceramsoc.2006.04.037.
[16] M. Chmielewski, Proceedings of SPIE the International Society for Optical Engineering, (2005) https://doi.org/10.1117/12.610676.
[17] A.L. Molisani, H.N. Yoshimura, Materials Science Forum scientific (2010) https://doi.org/10.4028/www.scientific.net/MSF.660-661.658.
[18] B. Kabaar, A.C. Buttay, O. Dezellus, R. Estevez, A. Gravouil, L. Gremillard, Microelectron. Reliab. (2017) https://doi.org/10.1016/j.microrel.2017.06.001.
[19] G. Dong, C. Xu, X. Zhang, K.D.T. Ngo, G.Q. Lu, Solder. Surf. Mt. Tech. (2010) https://doi.org/info:doi/10.1108/09540911011036280.
[20] J. Shi, Q. Wang, J. Li, J. Xiong, J. Feng, Mater. Charact. (2019) https://doi.org/10.1016/j.matchar.2019.109850.
[21] Y.W. A, Z.W.Y. A, L.X.Z. B, D.P.W. A, J.C.F. B, J. Materiomics, (2016) https://doi.org/10.1016/j.jmat.2015.10.003
[22] J. Ba, X.H. Zheng, R. Ning, J.H. Lin, J.L. Qi, J. Cao, W. Cai, J.C. Feng, Ceram. Int. (2018) https://doi.org/10.1016/j.ceramint.2018.03.018.
[23] H. Xu, F. Meng, X. Lei, J. Yang, Y. Zhao, Ceram. Int. (2020) https://doi.org/10.1016/j.ceramint.2020.07.047.
[24] M. Keita, M. Tomoki, S. Tomokazu, H. Akio, J. Electron. Mater. (2018) https://doi.org/10.1007/s11664-018-6504-2.
[25] J.L. Lv, Y.L. Huang, R.L. Fu, Y.R. Ji, B.Y. Wu, X.H. Liu, J. Eur. Ceram. Soc. (2020) https://doi.org/10.1016/j.jeurceramsoc.2020.07.060.
[26] G.Z. Ren, T.C. Zhang, X.C. Wang, The reactions of CuO at high pressure and high temperature, J. Phys-Condens. Mat. (2002) https://doi.org/10.1088/0953-8984/14/44/448.
[27] A. Kara-Slimane, D. Juve, E. Leblond, D. Treheux, J. Eur. Ceram. Soc. (2000) https://doi.org/10.1016/S0955-2219(00)00037-6.
[28] K.T. Jacob, C.B. Alock, J. cheminformatics (1975) https://doi.org/10.1111/j.1151-2916.1975.tb11441.x.
[29] Y.H. Huang, S.F. Wang, A.P. Tsai, S. Kameoka, Ceram. Int. (2014) https://doi.org/10.1016/j.ceramint.2013.08.130.
[30] X.W. Zuo, C.C. Zhao, L. Zhang, E.G. Wang, Materials (2016) https://doi.org/10.3390/ma9070569.
[31] G. Wang, Y.J. Cai, W. Wang, J. Manuf. Process (2019) https://doi.org/10.1016/j.jmapro.2019.03.023.