Polyamides have a relatively low surface energy of approx. 40 mJ/m² [1] and correspondingly poor adhesion properties. Pre-treatment of the polyamide surface is therefore necessary for a strong and secure bond. There are various options for pre-treatment, such as mechanical pre-treatment by grinding or blasting, chemical processes such as the use of primers, or physical processes such as plasma or laser pre-treatment. Mechanical processes are mainly used to increase the surface area and to create binding partners through chain breaks [2]. The effectiveness of this type of pretreatment is limited, especially for thermoplastic materials with difficult wetting behavior. The use of primers can lead to a significant increase in bond strength [3]. However, primer application is a critical process that is difficult to automate and involves the use of chemicals that are critical to health and the environment. Physical processes such as atmospheric pressure plasma are less harmful. These pre-treatments do not require any critical chemicals, are easy to automate and at the same time are able to create high adhesive strengths by incorporating functional groups into the polymer surface [3]. Plasma processes are therefore preferable to chemical activation using primers [4].
Atmospheric pressure plasma jet pre-treatment (APPJ pre-treatment) is a widely used industrial process for the pre-treatment of thermoplastics due to its comparatively low system costs, fast process times and good automation capacity [3, 5]. In contrast to corona pre-treatment, individually shaped surfaces can be treated [6] and there are no requirements for electrical conductivity [7]. APPJ pre-treatment often uses a so-called cold plasma with relatively low temperatures, which prevents thermal damage to the material. According to Habenicht, the temperatures of the plasma current are between 50°C and 150°C [1], but higher temperatures of over 1,000°C are also common [5]. The plasma generated by an electrical discharge contains ions, electrons and radicals and is therefore highly reactive. In APPJ processes, the plasma is applied to the surface by a gas flow, where it reacts and activates the surface. At the same time, minor contaminants can be removed due to the physical fine cleaning effect of the plasma [8]. By varying the process gas, different plasmas and correspondingly different functionalizations can be generated [9]. Common process gases include compressed air, oxygen, nitrogen [3], argon [10] or helium-based gas mixtures [11]. The aim is to activate the surface through oxygen or nitrogen functionalization, whereby both mechanisms can occur when compressed air is used as the process gas. Aside from the process gas and system-related parameters such as the shape of the plasma jet, the jet distance to the substrate and the jet speed have the greatest influence on the process result [12, 7]. Particularly with high-energy plasmas, excessive energy input during the pretreatment process can lead to overtreatment. The thermal input or radiation produces oxidized material with a low molecular weight (LMWOM - low molecular weight oxidized materials), so-called molecular scrap on the surface. These LMWOM do not have a strong bond to the substrate and therefore hinder secure bonding. The formation of such groups must be prevented accordingly [13, 14].
While the APPJ pre-treatment for polyamides has been researched in various publications, but the water content in the material has not been thoroughly addressed yet. In a series of publications, Gao et al. investigated the APPJ pretreatment of polyamide 6 films with a gas mixture of helium and oxygen. In T-peel tests, an increase in peel resistance of over 30% was observed due to an increase in the number of oxide groups [11]. Gao et al. also looked at the influence of relative humidity on the pre-treatment process. The humidity of the air had an influence on bond formation. At higher humidity, the number of oxide bonds increased. However, the resulting improvement in peel strength compared to a dry environment was only marginal at less than 10% [15]. In another publication, Gao et al. investigated the influence of the water content in the polyamide on bond formation by APPJ pretreatment. At high water content, a significantly lower chemical change was observed in the polymer than at low water content. Fewer oxide and nitrogen bonds were detected on the surface [16]. These measurements were not validated with mechanical tests in order to make reliable statements about the influence of water content on the adhesion conditions.
Schäfer et al. investigated the surface pretreatment of carbon fiber-reinforced polyamide 6 using APPJ to produce semi-structural bonds [13]. Two unspecified PUR adhesives were used. For the tests, the polyamide 6 material was conditioned to a water content of 0.85% in accordance to EN ISO 1110. The jet distance, jet speed and number of passes were varied. An increase in surface energy and an increase in oxide groups was measured as a result of the pre-treatment. At low jet spacing and speed, the adhesive strength was greatly reduced due to overtreatment. The high thermal energy input resulted in LMWOMs on the surface. The best results were obtained by repeating passes at high speed and jet spacing, i.e. low energy input. Schäfer et al. achieved cohesive fractures at up to 20 MPa in tensile shear tests according to EN 1465, which corresponded to more than a doubling of the initial strength. The effectiveness of repeated passes with low energy input was partly justified by the possible removal of the remaining water content in the surface. However, no further investigations were carried out to investigate this influence [13].
For other joining technologies, the effect of the water content on the respective joining process has been investigated. Götze et al. found that dry polyamide nanofiber materials widen the process window of laser structuring or laser cutting processes [17]. Van Aaken investigated the influence of moisture in polyamide 6 and polyamide 66 on the ultrasonic welding process. A general influence of moisture on the weld seam quality and the required process time was identified [18]. The laser welding process of polyamides is also significantly influenced by the water content in the material. The water content has an influence both on the absorption behavior of the laser radiation [19] and on the seam quality [20].
The research shows a large knowledge gap in adhesive bonding technology with regard to the effects of the water content in polyamides on the APPJ pre-treatment and properties of the resulting bond. Despite the known significance of the water content and its influence on the material’s properties, as well as the knowledge about the influence of other joining technologies, for the APPJ pre-treatment process the exact influence of water has not been understood yet.