Figure 1 shows a magnetoresistance curve for the GMR pillar before the current annealing. The initial GMR effect is extremely small at only 0.04% and is very unstable, with only anti-parallel configurations to be stable without magnetic field applications. This is most likely due to the lack of crystallisation in the Heusler alloy layer, which is known to form an amorphous phase in the as deposited state 14. Such an amorphous phase reduces the magnetisation significantly and thus the GMR effect. Furthermore, possible edge damage effects caused by the ion-milling of the GMR pillar affect device properties. The interfacial roughness induced during the deposition also creates nucleation sites for the magnetisation reversal, hence a reduced coercivity resulting in a lack of stability for an antiparallel configuration. After the introduction of a current of 500 μA in a series, the shape of the GMR curves is maintained but the resistance values are changed as shown in the supplemental information.
The resistance changes after a series of current pulse applications of 500 µA up to 5 mA for 100 µs up to 500 µs are shown in Fig. 2 in a GMR junction, consisting of CFAS/Ag/CFAS. Note that the standard error is taken in the last 25 point of the data, resulting in a value of 200 µW, which is far below the changes in the resistance. By applying a pulse current up to 25,000 times with different conditions, the resistance changes almost monotonically, which is expected to be due to the competition of the CFAS Heusler-alloy crystallisation. Little change is observed at 500 μA, as in the GMR measurement in Fig. 1. After a series of current applications (current pulse N > 15,000 times in Fig. 2), the resistance become saturated, suggesting the current-induced crystallisation is completed. These results confirm that the GMR nanopillar can be used for neuromorphic operation as reported for a TMR nanopillar 10,11,12,13.
Using Ohm’s law, the application of a 100 µA current for 10 s introduces 6.24×10-14 J to a Heusler alloy nanopillar (10 nm thick and 100 nm diameter), assuming the resistivity is similar to that of Co (6.24 nW×m). For an ideal case, this increases the temperature of the Heusler layer by 51.5K, since the heat capacity of Co is 24.81 J/mol×K and the density of Co is 8.90 g/cm3. Hence, current-induced annealing is achieved. This can offer the data-logging functionality into a neuromorphic computing device with a GMR junction. Here, the steps of the data-logging can be controlled by the amplitude and duration of the current flow.
The nanostructure and layer thicknesses of the GMR device after a series of current-induced annealing applications to saturate the resistance were investigated using cross-sectional transmission electron microscope (TEM) observation. Figures 3(a) and (b) show bright field cross-sectional TEM images of the device with 300k and 800k magnification, respectively. The actual layer thicknesses of the GMR device were measured to be Si/SiO2//W (11.1)/CFAS (11.5)/Ag (4.2)/CFAS (4.6)/Ru (3.5) (thickness in nm). Lattice fringes of the CFAS was observed in the cross-sectional TEM image in Fig. 3(b). The crystallinity of the CFAS has been confirmed using nanobeam as shown in Fig. 3(c). A diffraction ring patter was observed, however some diffraction spots were also observed within the ring region. It represented CFAS was partially crystallised after current annealing took place. The CFAS(220) diffraction ring was observed at 5.1 nm-1 from the centre spot. Therefore, the lattice constant of CFAS is estimated to be 0.57 nm, which is 101.3% of the CFAS film grown at 673K estimated by the corresponding XRD result previously 15. The structural analysis via TEM imaging confirmed CFAS pillars after the current introduction was partially crystallised and maintained a smooth interface of < 1 nm roughness in the GMR junction.
The reduction in the resistance in Fig. 2 and the corresponding TEM images in Fig. 3 confirm the current-induced crystallisation into the B2 phase of the Heusler alloy film. By assuming the film is in a circular disc shape with the diameter of 100 nm and the thickness of 10 nm, the heating value required to increase the temperature from 300K to 353K is calculated by multiplying the mass, specific heat capacity and increased temperature, resulting in 3.31´10-11 J using the parameters for Co for simple estimation. This value is almost comparable with the Joule heating by applying an electrical current of 1 µA into the above circular disc at a voltage of 10 µV for 1 s, i.e., 1´10-11 J. One can therefore conclude that the ternary/quaternary Heusler alloy films can be crystallised by 10 steps by simply flowing a pulsed current of 100 ms or less into the films, offering a new nanoscale device fabrication method of current-induced crystallisation.
In summary, the concept of the current-induced crystallisation has been successfully demonstrated in a Heusler-alloy GMR junction. Due to the nature of a simple electrical current introduction, a nanoelectronics device does not require annealing processes but stores the operation cycle permanently, which minimises any atomic diffusion and interfacial mixing to degrade their performance. Hence, such current-induced crystallisation is expected to be used in a variety of nanoelectronics devices, including a neuromorphic node network, which can revolutionalise solid state memory.